TIF Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features
　Soft and Compressible for low stress applications
　Naturally tacky needing no further adhesive coating
　Good thermal conductive
　Available in varies thickness
Application
　Cooling components to the chassis of frame
　High speed mass storage drives
　RDRAM memory modules
　Micro heat pipe thermal solutions
　Automotive engine control units
　Telecommunication hardware
　Handheld portable electronics
　Semiconductor automated test equipment (ATE)