The TIC™800G Series is low melting point thermal interface material. At 50℃, The TIC™800G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

Features
》0.014℃-in² /W thermal resistance
》Naturally tacky at room temperature, no adhesive required            
》No heat sink preheating required

Applications
》High Frequency Microprocessors
》Notebook and Desktop PCs
》Computer Serves
》Memory Modules
》Cache Chips
》IGBTs

Standard Thicknesses:
0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                 
Consult the factory alternate thickness.

Standard Sizes:
9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)                     
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.