TIA™ Series Thermally Conductive Tapes
The TIA™ Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
|
Item |
Color |
Thickness (mm) |
Thermal Conductivity(W/mK) |
Peel Adhesion
g/inch2 |
Breakdown Voltage (V-AC) |
|
TIA800 Series |
White |
0.127～0.508 |
0.9 |
1200 |
>2000～>3500 |
|
TIA800FG Series |
White |
0.152～0.508 |
0.9 |
1200 |
>2000～>3500 | |
|
