
Data Center & AI
Leading AI Optical Interconnect OEM
800G / 1.6T AI Optical Module Thermal Solution
Ultra-soft TIF700UU pad and TIC800T-ST PCM-metal composite for next-gen 800G and 1.6T optical transceivers in AI data centers — 10 psi lower compression stress at 70% deflection.
−10 psi
Compression stress vs competitor

