As AI training and HPC increase computing demand, GPU power and heat density continue to rise. Ziitek delivers TIM1, TIM1.5, and TIM2 thermal interface solutions for cold plate, immersion cooling, optical modules, and bare-die designs, improving junction temperatures, reliability, and total cost of ownership.
AI servers are accelerating the transition of data centers into the liquid cooling era. As GPU power consumption exceeds 700W per device, conventional air-cooling technologies are approaching their thermal limits. While liquid cooling significantly improves heat dissipation efficiency, it also raises new requirements for thermal interface materials. TIMs are no longer simple gap fillers but have become critical components that directly impact system performance, reliability, and operational costs. Leveraging extensive expertise in thermal materials, Ziitek delivers comprehensive thermal management solutions from chip level to system level.
Scene challenges
Solution value
As AI clusters continue to scale, server power consumption and thermal demands are increasing dramatically. Liquid cooling is evolving from an optional technology into a core component of AI infrastructure. In this transition, TIMs have become strategic engineering components that influence system reliability, maintenance cycles, and overall energy efficiency.
In cold plate cooling systems, TIMs must withstand thermal cycling, mechanical vibration, and high assembly pressure. Advanced packaging technologies such as CoWoS introduce warpage challenges that can lead to interface degradation, pump-out effects, and increased thermal resistance.
Ziitek offers PCM materials, thermal gels, thermal greases, and carbon-based TIMs to achieve low thermal resistance, high consistency, and long-term stability.
As AI processors increasingly eliminate IHS structures, TIM1.5 becomes the critical interface between bare dies and cold plates. These materials must provide not only ultra-low thermal resistance but also mechanical stress buffering to protect fragile dies.
Ziitek's liquid metal and liquid metal thermal compounds combine exceptional thermal conductivity with ultra-low stress characteristics, delivering ultimate cooling performance for next-generation AI processors.
Height differences among server components create significant thermal interface challenges. Conventional gap fillers may impose excessive stress on sensitive components such as capacitors and inductors.
Ziitek ultra-soft thermal pads deliver high thermal conductivity while minimizing compression stress, improving long-term reliability and simplifying thermal design.
For immersion cooling systems, TIMs must satisfy thermal performance, coolant compatibility, and long-term reliability requirements simultaneously. Interactions among TIMs, coolants, IHS structures, and system components have become critical factors affecting system lifespan.
Through long-term immersion testing, boiling fatigue testing, and system-level validation, Ziitek delivers highly reliable immersion cooling solutions.
As 800G and 1.6T optical modules become mainstream, thermal management has emerged as a critical challenge. Materials must balance thermal conductivity, low outgassing, and repeated insertion durability.
Ziitek PCM composite solutions maintain stable thermal performance through repeated insertion cycles, ensuring long-term reliability for high-performance optical modules.
Application | Product P/N | Core advantages |
|---|---|---|
Cold Plate TIM1 | TIC 800T / TIC 800M | Ultra-low thermal resistance and high reliability |
Cold Plate TIM2 | TIG 780-56 | Mature and high cost-effective |
Cold Plate TIM2 | TIF PT150 | Automated production, long serving life |
High Power GPU | TIR 700 | Ultimate heat conduction performance |
TIM1.5 | TIG 7835L / TIG 7835N | Liquid metal, ultimate heat dissipation |
Stress Management | TIF 700UU / 800TU / 800XU | Ultra-soft and low-stress design |
Immersion Cooling | TIF 100C | Coolant compatible |
Optical Module | TIC 800T-ST | High durability and high reliability |
Leading Embodied-AI Humanoid Robot Developer
A five-material thermal stack — TIF700RUS pad, PCM-TIC800H, TIF090-11 gel, TIF100-30-11S pad, and TIG680 potting — cooled the AI processor by 18.5 °C, extended full-load runtime from under 45 minutes to over 2 hours, and raised MTBF above 5,000 hours.
−18.5 °C
AI processor temperature
Leading AI Optical Interconnect OEM
Ultra-soft TIF700UU pad and TIC800T-ST PCM-metal composite for next-gen 800G and 1.6T optical transceivers in AI data centers — 10 psi lower compression stress at 70% deflection.
−10 psi
Compression stress vs competitor
From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 5,000+ clients across EV, 5G, and consumer electronics.
