KHEAT-SP Film Heating Element
- Dielectric Breakdown Voltage
- ≥2500VAC/MIN
- Max Power Density
- 2.0W/cm²
- Recommended Power Density
- 0.1-0.6W/cm²
- Thickness
- 1.1~5 mm
- Continuous Use Temp
- 200°C (it depends on temperature stabil…
- Continuous Use Temp
- -50~200°C
KHEAT-SP — Product overview
Kheat™ SP-Silica gel heating plate is a heating material developed and produced independently by Ziitek company. The silica gel plate has excellent weather and aging resistance. As an insulation material on the heating plate, it can enhance the mechanical strength and effectively prevent surface cracking, greatly extending the service life of the products. The plate can be customized according to design requirements.
KHEAT-SP — Features
Thickness of resistor
Silica gel heating plate enables good contact between heating elements and heated produ…
Made of two silica gel heating sheets and resistor laminated by high temperature; can b…
Can be customized according to shape, size, power and voltage
Silica gel heating plate has good chemical corrosion resistance and can be used in humi…
Can be easily integrated with thin insulation materials, providing lightweight electric…
Where this grade is used
Typical application targets for this grade include New energy industry (battery), Communication security industry, Video camera, hard disk video recorder, Power industry, military aerospace, All kinds of electronic products that need to be heated, Medical equipment, precision instruments and equipment.
KHEAT-SP — datasheet specifications
Values below are transcribed from the official datasheet (PDF: Kheat-SP-英.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) |
|---|---|
| Operating Voltage | 1-380V AC/DC |
| Continuous Use Temp | 200°C (it depends on temperature stability of the adhesive if customer needs adhesive) |
| Dielectric Breakdown Voltage | ≥2500VAC/MIN |
| Continuous Use Temp | -50~200°C |
| Insulation Resistance (MΩ) | ≥100 |
| Thickness | 1.1-2.0mm (2.0-5mm customizable) |
| Recommended Power Density | 0.1-0.6W/cm² |
| Mechanical Compression Strength | 100KG/cm² |
| Max Power Density | 2.0W/cm² |
| Pull Force of Guide Line | ≥80N |
| Service Life | 8~15 years |
| Pull Force of Soldering Point | ≥20N |
* Match values to the PDF revision cited on your purchase order.
Related kapton and polyimide heating films models
| Model | Power Density | Operating Temp | View |
|---|---|---|---|
| KHEAT-PI | 0.1-0.6W/cm² | 200°C (it depends on temperature stability of the adhesive if customer needs adhesive.) | Details |
KHEAT-SP — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of KHEAT-SP?
The customer workbook lists nominal through-plane conductivity as — W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply KHEAT-SP die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Kapton and polyimide heating films parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for KHEAT-SP?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is KHEAT-SP RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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