Z-PASTER-100-30-10UF Non-Silicone Thermal Pad
- Dielectric Breakdown Voltage
- >5000 VAC
- Dielectric Constant
- 5.5
- Flame Rating
- V0
- Hardness (Shore OO)
- 75
- Specific Gravity (g/cm³)
- 2.88
- Thermal Conductivity (W/m·K)
- 3.0
Z-PASTER-100-30-10UF — Product overview
Z-Paster™100-30-10UF Series is a high performance and compatible non-silicone material of the thermal conductive interface materials. The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Z-PASTER-100-30-10UF — Features
Silicone-free
Meets ROSH standards
Good thermal conductive
Available in varies thickness
Where this grade is used
Typical application targets for this grade include Cooling components to the chassis of frame, Car Battery & Power Supply, Charging Pile, Silicone-sensitive applications, Graphics Card Thermal Module, Set Top Box, Medical devices, SFP optical module.
Z-PASTER-100-30-10UF — datasheet specifications
Values below are transcribed from the official datasheet (PDF: Z-PASTER100-30-10UF-Silicone-free-Thermal-conductive-material-DATASHEET.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Grey | Visual |
| Construction | Silicone-free / The metal oxide fills | — |
| Thickness range | 0.020"(0.5mm)~0.200"(5.0mm) | ASTM D374 |
| Hardness (Shore OO) | 75 | ASTM 2240 |
| Specific Gravity (g/cm³) | 2.88 | ASTM D297 |
| Continuous Use Temp | −20~125°C | — |
| Dielectric Breakdown Voltage | >5000 VAC | ASTM D150 |
| Dielectric Constant | 5.5 | ASTM D150 |
| Volume Resistivity (Ω·cm) | 6.0×10¹³ | ASTM D257 |
| Thermal Conductivity (W/m·K) | 3.0 | ASTM D5470 |
| Thermal Conductivity (W/m·K) | 3.0 | ISO22007-2.2 |
| Flame Rating | V0 | UL94 |
* Match values to the PDF revision cited on your purchase order.
Related non-silicone thermal pads models
Z-PASTER-100-30-10UF — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of Z-PASTER-100-30-10UF?
The customer workbook lists nominal through-plane conductivity as 3 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply Z-PASTER-100-30-10UF die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Non-silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for Z-PASTER-100-30-10UF?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is Z-PASTER-100-30-10UF RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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