TIC800A-AL Phase Change Material
- Density (g/cm³)
- 2.5
- Operating Temperature Ran…
- -25~125
- Thermal Conductivity (W/m·K)
- 2.5
- Thickness
- 0.126~0.508 mm
- Thickness Tolerance
- ±0.0008 / ±0.019 / ±0.0008 / ±0.019 / ±…
- Backing Material
- Aluminum foil
TIC800A-AL — Product overview
TIC800A-AL series is a low-melting-point phase change thermal interface material on an aluminum-foil carrier. At 50°C, the material begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance. It is a flexible solid at room temperature and freestanding, without reinforcing components that would reduce thermal performance. The material softens but does not fully change state, resulting in minimal migration (no pump-out) at operating temperatures, and shows no thermal performance degradation after 1,000 hours at 130°C or after 500 thermal cycles from -25°C to 125°C.
TIC800A-AL — Features
Lowest thermal resistance
Naturally tacky at room temperature
No adhesive required
Phase change at 50°C softens and flows into bondline irregularities
Minimal pump-out
Material softens but does not fully liquefy
Aluminum-foil backing for handling and dimensional stability
No heat sink preheating required
Where this grade is used
Typical application targets for this grade include High-frequency microprocessors, Notebook and desktop PCs, Computer servers, Memory modules, Cache chips.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIC800A-AL — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIIC800A-AL-产品说明书（英）.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Product Name | TIC™805A-AL / TIC™808A-AL / TIC™810A-AL / TIC™820A-AL | — |
| Color | Gray / Silver | Visual |
| Backing Material | Aluminum foil | — |
| Thickness | 0.005" (0.126 mm) / 0.008" (0.203 mm) / 0.010" (0.254 mm) / 0.020" (0.508 mm) | — |
| Thickness Tolerance | ±0.0008 / ±0.019 / ±0.0008 / ±0.019 / ±0.0012 / ±0.030 / ±0.0020 / ±0.050 | — |
| Density (g/cm³) | 2.5 | — |
| Operating Temperature Range (°C) | -25~125 | — |
| Phase Change Softening Temperature (°C) | 50~60 | — |
| Thermal Conductivity (W/m·K) | 2.5 | ASTM D5470 (modified) |
| Thermal Impedance @50psi (345 KPa) | 0.063 / 0.080 / 0.097 / 0.175 °C·in²/W; 0.40 / 0.52 / 0.63 / 1.13 °C·cm²/W | ASTM D5470 (modified) |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC800A-AL — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC800A-AL?
The customer workbook lists nominal through-plane conductivity as 2.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC800A-AL die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC800A-AL?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC800A-AL RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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