TIC800D Phase Change Material
- Composite Thickness
- 0.102 mm
- Dielectric Breakdown Volt…
- 5000
- Dielectric Constant @1MHz
- 1.8
- Kapton MT Thickness
- 0.025 mm
- Thermal Conductivity (W/m·K)
- 1.6
- Total Thickness
- 0.127 mm
TIC800D — Product overview
TIC800D series is a high thermal conductivity, high dielectric strength insulating phase change pad. It consists of a polyimide (Kapton MT) film substrate coated with a low-melting-point phase change material filled with a ceramic blend. At 50°C the coating begins to soften and flow, effectively filling microscopic surface irregularities between the heat sink and the integrated circuit, thereby reducing thermal resistance and enhancing heat transfer while maintaining high voltage isolation.
TIC800D — Features
Highly compliant surface with high thermal conductivity
High dielectric strength (5000 VAC) for primary electrical isolation
Low thermal resistance combined with high voltage isolation
Resistant to tears and punctures thanks to polyimide reinforcement
Phase change at 50
Where this grade is used
Typical application targets for this grade include Power semiconductors, MOSFETs and IGBTs, Audio and video components, Automotive control devices, Electric motor control equipment.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIC800D — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIC800D-TDS-EN.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Typical Properties | ||
| Color | Light Amber | Visual |
| Reinforcement / Backing | Polyimide (Kapton MT) film | — |
| Composite Thickness | 0.004" (0.102 mm) | ASTM D374 |
| Kapton MT Thickness | 0.001" (0.025 mm) | ASTM D374 |
| Total Thickness | 0.005" (0.127 mm) | ASTM D374 |
| Tensile Strength (MPa) | 17 | ASTM D412 |
| Recommended Use Temperature (°C) | -50~130 | Ziitek Test Method |
| Phase Change Softening Temperature (°C) | 50~60 | — |
| Electrical | ||
| Dielectric Breakdown Voltage (VAC) | 5000 | ASTM D149 |
| Dielectric Constant @1MHz | 1.8 | ASTM D150 |
| Volume Resistivity (Ω·m) | 1.0×10¹² | ASTM D257 |
| Thermal conductivity | ||
| Thermal Conductivity (W/m·K) | 1.6 | ASTM D5470 |
| Thermal Impedance @50psi (°C·in²/W) | 0.22 | ASTM D5470 |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC800D — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC800D?
The customer workbook lists nominal through-plane conductivity as 1.6 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC800D die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC800D?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC800D RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
Your next thermal solution
starts here.
From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 5,000+ clients across EV, 5G, and consumer electronics.