TIC800G-ST Phase Change Material
- PCM Layer Thickness
- 0.127 mm
- Recommended Operating Tem…
- -45~125
- Stainless Steel Film Thic…
- 0.025 mm
- Thermal Conductivity (W/m·K)
- 5.0
- Total Thickness
- 0.152 mm
- Color
- Gray
TIC800G-ST — Product overview
TIC800G-ST series phase change thermal pad is a phase-change composite material specifically designed for applications requiring repeated assembly, such as filling the gaps between removable optical modules and heat sinks. It delivers excellent thermal conductivity and tacky adhesion for easy attachment to heat sinks. The construction combines a 0.005" PCM layer (5.0 W/m·K) with a 0.001" stainless steel film reinforcement; this engineered film composite withstands repeated insertion and removal of optical modules without tearing, protecting the surfaces of both the heat sink and the optical module while minimizing thermal resistance.
TIC800G-ST — Features
Good thermal conductivity (5.0 W/m·K)
Durable, abrasion-resistant stainless-steel-film reinforced surface
Optimized tack for efficient handling and attachment
Excellent surface wettability with low interface resistance
Phase change at 50
Stainless steel film reinforcement enables repeated module insertion/removal without te…
Where this grade is used
Typical application targets for this grade include Optical modules, Servers, switches and routers, Data infrastructure, Network cabinets.
TIC800G-ST — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIC800G-ST-TDS-EN.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Gray | Visual |
| Reinforcement / Backing | Stainless steel film 0.001" (0.025 mm) | — |
| PCM Layer Thickness | 0.005" (0.127 mm) | ASTM D374 |
| Stainless Steel Film Thickness | 0.001" (0.025 mm) | ASTM D374 |
| Total Thickness | 0.006" (0.152 mm) | ASTM D374 |
| Recommended Operating Temperature (°C) | -45~125 | Ziitek Test Method |
| Phase Change Temperature (°C) | 50~60 | Ziitek Test Method |
| Thermal Conductivity (W/m·K) | 5.0 | ASTM D5470 |
| PCM Thermal Resistance @50psi (°C·in²/W) | 0.014 | ASTM D5470 |
| Thermal Resistance @50psi (°C·in²/W) | 0.061 | ASTM D5470 |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC800G-ST — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC800G-ST?
The customer workbook lists nominal through-plane conductivity as 5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC800G-ST die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC800G-ST?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC800G-ST RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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