TIC800G Phase Change Material
- Density (g/cm³)
- 2.6
- Recommended Operating Tem…
- -40~125
- Thermal Conductivity (W/m·K)
- 5.0
- Thickness
- 0.127~0.305 mm
- Color
- Gray
- Phase Change Softening Te…
- 50~60
TIC800G — Product overview
TIC800G series is a high-performance, cost-effective phase change thermal interface material with a 5.0 W/m·K formulation. Its grain-oriented structure enables precise conformity to device surfaces, enhancing the thermal conduction path and transfer efficiency. When the temperature exceeds its phase transition point of 50°C, the material softens and undergoes phase change, effectively filling microscopic and uneven gaps between components to form a low thermal resistance interface — significantly improving heat dissipation performance over greases and pads.
TIC800G — Features
Low thermal resistance
As low as 0.014 °C·in²/W at 0.005" (TIC805G)
Self-adhesive with no need for additional surface adhesives
Performs in low-pressure application environments
Phase change at 50
Grain-oriented structure for precise conformity to device surfaces
Where this grade is used
Typical application targets for this grade include Power conversion equipment, Power supply and vehicle storage battery, Large communication switch hardware, LED TV and lighting, Laptop computers.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIC800G — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIC800G-TDS-EN.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Product Name | TIC®805G / TIC®806G / TIC®808G / TIC®810G / TIC®812G | — |
| Color | Gray | Visual |
| Thickness | 0.005" (0.127 mm) / 0.006" (0.152 mm) / 0.008" (0.203 mm) / 0.010" (0.254 mm) / 0.012" (0.305 mm) | ASTM D374 |
| Density (g/cm³) | 2.6 | ASTM D792 |
| Recommended Operating Temperature (°C) | -40~125 | — |
| Phase Change Softening Temperature (°C) | 50~60 | — |
| Thermal Conductivity (W/m·K) | 5.0 | ASTM D5470 |
| Thermal Impedance @50psi (°C·in²/W) | 0.014 / 0.018 / 0.020 / 0.024 / 0.028 | ASTM D5470 |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC800G — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC800G?
The customer workbook lists nominal through-plane conductivity as 5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC800G die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC800G?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC800G RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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