TIC800H-SP Phase Change Material
- Density (g/cm³)
- 2.6
- Thermal Conductivity (W/m·K)
- 7.5
- Viscosity (mPa·s)
- 38000
- Color
- Gray
- Form Factor
- Paste (SP)
- Packaging
- 0.5kg~2kg kg
TIC800H-SP — Product overview
TIC800H-SP Series is a phase change material supplied as a paste, designed to minimize thermal resistance at the interface and maintain extremely stable performance through the reliability testing required for long-life applications. Based on a robust polymer phase change memory structure, this material exhibits excellent wetting properties within a typical operating temperature range, resulting in extremely low surface contact resistance. The proprietary technology delivers excellent reliability while maintaining low thermal impedance, making it an ideal choice for high-performance integrated circuit devices.
TIC800H-SP — Features
High-performance filler and polymer technology
Highly conductive filler loading optimized for performance
Superior handling and reworkability
Applied as a paste
Superior reliable thermal performance through reliability testing
Phase-change polymer wets the interface for extremely low contact resistance
Where this grade is used
Typical application targets for this grade include Automotive and power electronics, IT and enterprise computing, Telecommunications, Consumer electronics, High-brightness LED.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIC800H-SP — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIC800H-SP_Data-sheet-.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Form Factor | Paste (SP) | — |
| Color | Gray | Visual |
| Density (g/cm³) | 2.6 | ASTM D792 |
| Thermal Conductivity (W/m·K) | 7.5 | ASTM D5470 |
| Thermal Impedance @10psi (°C·in²/W) | 0.03 | ASTM D5470 |
| Thermal Impedance @50psi (°C·in²/W) | 0.02 | ASTM D5470 |
| Viscosity (mPa·s) | 38000 | GB/T 10247 |
| Packaging | 0.5kg / 1kg / 2kg | — |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC800H-SP — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC800H-SP?
The customer workbook lists nominal through-plane conductivity as 7.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC800H-SP die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC800H-SP?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC800H-SP RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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