TIC800H Phase Change Material
- Density (g/cm³)
- 2.7
- Recommended Operating Tem…
- -40~125
- Thermal Conductivity (W/m·K)
- 7.5
- Thickness
- 0.20~0.30 mm
- Color
- Gray
- Phase Change Softening Te…
- 50~60
TIC800H — Product overview
TIC800H Series is an ultra-high thermal conductivity (7.5 W/m·K) phase change material with a unique grain orientation structure. The micro-ordered arrangement directionally optimizes the heat-flow path, significantly increasing the macroscopic thermal conductivity efficiency. When the temperature exceeds the phase transition point of 50°C, the material softens and infiltrates the interface, filling micro-irregular gaps and forming a heat conduction channel with extremely low thermal resistance at the contact surface — improving the efficiency of the heat dissipation system.
TIC800H — Features
Excellent thermal conductivity (7.5 W/m·K)
Good process compatibility
Soft surface and self-adhesive
Low steady-state thermal resistance after phase change cycle (no pump-out)
Phase change at 50
Grain-oriented structure for directional heat flow optimization
Where this grade is used
Typical application targets for this grade include Power conversion equipment, Payload processors, Server CPUs, Game graphics card GPU chip heat dissipation.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIC800H — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIC800H_Data Sheet .pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Product Name | TIC®808H / TIC®810H / TIC®812H | — |
| Color | Gray | Visual |
| Thickness | 0.008" (0.20 mm) / 0.010" (0.25 mm) / 0.012" (0.30 mm) | ASTM D374 |
| Density (g/cm³) | 2.7 | ASTM D792 |
| Recommended Operating Temperature (°C) | -40~125 | — |
| Phase Change Softening Temperature (°C) | 50~60 | — |
| Thermal Conductivity (W/m·K) | 7.5 | ASTM D5470 |
| Thermal Impedance @10psi (°C·in²/W) | 0.018 / 0.019 / 0.021 | ASTM D5470 |
| Thermal Impedance @50psi (°C·in²/W) | 0.013 / 0.014 / 0.015 | ASTM D5470 |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC800H — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC800H?
The customer workbook lists nominal through-plane conductivity as 7.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC800H die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC800H?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC800H RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
Your next thermal solution
starts here.
From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 5,000+ clients across EV, 5G, and consumer electronics.