TIC800K-A1 Phase Change Material
- Breakdown Voltage (V/mm)
- 5000
- Density (g/cm³)
- 2.0
- Dielectric Constant @1MHz
- 4.5
- Recommended Operating Tem…
- -40~150
- Thermal Conductivity (W/m·K)
- 1.5
- Thickness Range
- 0.125~0.150 mm
TIC800K-A1 — Product overview
TIC800K-A1 series is a high-performance, cost-effective phase change thermal interface material with a non-silicone thermoplastic / polyimide film construction. Its unique grain directionality and plate structure allow it to conform precisely to the surface, amplifying the thermal conversion effect. At a temperature of 50°C — its phase transition point — the material begins a softening phase transition that fills the tiny irregular contact surfaces of the device, forming an interface with a small contact thermal resistance and achieving good heat dissipation. The A1 designator indicates a single-sided adhesive variant on a polyimide carrier.
TIC800K-A1 — Features
Low thermal resistance
Self-adhesive without the need for additional surface adhesives (single-sided adhesive)
Performs in low-pressure application environments
Phase change at 50
Non-silicone thermoplastic chemistry on polyimide film carrier
5000 V/mm dielectric breakdown for electrical isolation
Where this grade is used
Typical application targets for this grade include Power conversion equipment, Power supply and vehicle storage battery, Large communication switch hardware, LED TV / lighting, Laptop computers.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIC800K-A1 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIC800K-A1-TDS-EN.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Product Name | TIC®805K-A1 / TIC®806K-A1 | — |
| Construction | Non-silicone thermoplastic on polyimide film | — |
| Color | Yellow | Visual |
| Thickness Range | 0.005" (0.125 mm) / 0.006" (0.150 mm) | ASTM D374 |
| Density (g/cm³) | 2.0 | ASTM D792 |
| Recommended Operating Temperature (°C) | -40~150 | — |
| Phase Change Softening Temperature (°C) | 50~60 | — |
| Breakdown Voltage (V/mm) | 5000 | ASTM D149 |
| Dielectric Constant @1MHz | 4.5 | ASTM D150 |
| Volume Resistivity (Ω·cm) | 1.0×10¹² | ASTM D257 |
| Thermal Conductivity (W/m·K) | 1.5 | ASTM D5470 / ISO22007-2.2 |
| Thermal Impedance (°C·in²/W) | 0.20 / 0.21 | ASTM D5470 |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC800K-A1 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC800K-A1?
The customer workbook lists nominal through-plane conductivity as 1.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC800K-A1 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC800K-A1?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC800K-A1 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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