TIC800K Phase Change Material
- Aggregate thickness
- 0.127~0.203 mm
- Composite thickness
- 0.102~0.152 mm
- Dielectric Breakdown Volt…
- >5000
- Dielectric Constant @1MHz
- 1.8
- Polyimide film thickness
- 0.0254~0.0508 mm
- Specific Gravity (g/cm³)
- 2.0
TIC800K — Product overview
TIC®800K series is a high thermal conductivity and high dielectric constant insulating pad. It consists of a polyimide film substrate coated with a low-melting-point phase change material filled with ceramic blend. At 50°C, the material surface begins to soften and flow, effectively filling microscopic surface irregularities between the heat sink and the integrated circuit board, thereby reducing thermal resistance and enhancing heat transfer efficiency.
TIC800K — Features
The surface is relatively soft and has good heat conductivity
Good dielectric strength
High-voltage insulation, low thermal resistance
Anti-tear, anti-puncture
Where this grade is used
Typical application targets for this grade include Power conversion equipment, Power semiconductors, MOSFETs, and IGBTs, Audio and video components, Automotive control units, Motor controllers, General high voltage interface.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIC800K — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIC800K-Data-sheet-..pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Typical Properties | ||
| Product Name | TIC®805K / TIC®806K / TIC®808K | — |
| Construction | Polyimide film + low-melting-point phase change material with ceramic blend | — |
| Color | Light Amber | Visual |
| Composite thickness | 0.004" (0.102 mm) / 0.005" (0.127 mm) / 0.006" (0.152 mm) | ASTM D374 |
| Polyimide film thickness | 0.001" (0.0254 mm) / 0.001" (0.0254 mm) / 0.002" (0.0508 mm) | ASTM D374 |
| Aggregate thickness | 0.005" (0.127 mm) / 0.006" (0.152 mm) / 0.008" (0.203 mm) | ASTM D374 |
| Specific Gravity (g/cm³) | 2.0 | ASTM D792 |
| Specific heat volume (J/g·K) | 1.0 | ASTM C351 |
| Tensile Strength (MPa) | ≥110 | ASTM D412 |
| Recommended Operating Temp (°C) | -45~125 | — |
| Electrical | ||
| Dielectric Breakdown Voltage (VAC) | >5000 | ASTM D149 |
| Dielectric Constant @1MHz | 1.8 | ASTM D150 |
| Volume Resistivity (Ω·cm) | 3.5×10¹⁴ | ASTM D257 |
| Thermal conductivity | ||
| Thermal Conductivity (W/m·K) | 1.6 | ASTM D5470 |
| Thermal Impedance @50psi (°C·in²/W) | 0.12 / 0.13 / 0.16 | ASTM D5470 |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC800K — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC800K?
The customer workbook lists nominal through-plane conductivity as 1.6 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC800K die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC800K?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC800K RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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