TIC800M Phase Change Material
- Density (g/cm³) @25°C
- 8.0
- Phase Change Temperature …
- >60
- Recommended Operating Tem…
- -40~250
- Resistivity (Ω·m)
- <10^-4
- Thermal Conductivity (W/m…
- 18.9
- Color
- Silvery white
TIC800M — Product overview
TIC800M is a metal phase change thermal interface material (bismuth alloy) developed by mixing multiple metals to solve high-power heat dissipation problems and improve application reliability. The material delivers very high thermal conductivity (18.9 W/m·K), is not easily volatile, is safe and non-toxic, and has stable physical and chemical properties. When the temperature rises above its phase transition temperature (>60°C), the metal foil softens and undergoes phase transition, tightly filling the small irregular contact surfaces on the device to form a low contact thermal resistance interface — significantly outperforming polymer-based PCMs and greases on raw thermal conductivity.
TIC800M — Features
Excellent thermal conductivity
Non-toxic, environmentally friendly and safe
Meets RoHS requirements
Excellent long-term stability over service life
Phase change above 60°C thoroughly fills the contact surface for low thermal resistance
Not easily volatile
No evaporation or pump-out
Bismuth alloy construction in flaky solid form
Where this grade is used
Typical application targets for this grade include Microprocessors, Graphics processing chips, Set-top boxes, LED TV and LED lighting fixtures, Notebook computers.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIC800M — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIC800M_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Silvery white | Visual |
| Form | Flaky solid | Visual |
| Construction | Bismuth alloy | — |
| Density (g/cm³) @25°C | 8.0 | ASTM D792 |
| Thermal Conductivity (W/m·K) @25°C | 18.9 | ISO22007 |
| Specific Heat Capacity (J/g·°C) @25°C | 0.24 | ASTM E1269 |
| Resistivity (Ω·m) | <10^-4 | ASTM D257 |
| Phase Change Temperature Range (°C) | >60 | ASTM D3418 |
| Solidification Range (°C) | <57 | ASTM D3418 |
| Recommended Operating Temperature (°C) | -40~250 | — |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC800M — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC800M?
The customer workbook lists nominal through-plane conductivity as 18.9 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC800M die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC800M?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC800M RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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