TIC800P-K1 Phase Change Material
- Composite Thickness
- 0.0762~0.127 mm
- Density (g/cm³)
- 2.0
- Dielectric Breakdown Volt…
- >3000 / >3500 / >5000
- Dielectric Constant @1MHz
- 3.8
- MT Kapton Thickness
- 0.025 mm
- Thermal Conductivity (W/m·K)
- 1.6
TIC800P-K1 — Product overview
TIC800P-K1 series is a high thermal conductivity, high dielectric strength insulating phase change pad consisting of a ceramic-filled, low-melting-point compound coated on MT Kapton (polyimide) film. At 50°C the surface begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance. The Kapton reinforcement provides electrical isolation up to 5000 VAC and resistance to tears and punctures, making it well suited for power semiconductor isolation applications.
TIC800P-K1 — Features
Highly compliant surface combined with high thermal conductivity
High thermal conductivity together with high dielectric strength
Low thermal resistance with high voltage isolation
Resistant to tears and punctures (Kapton reinforced)
Phase change at 50°C softens material to fill bondline irregularities
Suitable for general high-pressure interface applications
Where this grade is used
Typical application targets for this grade include Power conversion equipment, Power semiconductors: TO packages, MOSFETs and IGBTs, Audio and video components, Automotive control units, Motor controllers, General high-pressure interface applications.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIC800P-K1 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIC800P-K1-TDS_EN_REV01.3.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Typical Properties | ||
| Product Name | TIC™804P-K1 / TIC™805P-K1 / TIC™806P-K1 | — |
| Color | Pink / Light Amber | Visual |
| Reinforcement / Backing | MT Kapton (polyimide) film | — |
| Composite Thickness | 0.003" (0.0762 mm) / 0.004" (0.102 mm) / 0.005" (0.127 mm) | ASTM D374 |
| MT Kapton Thickness | 0.001" (0.025 mm) | ASTM D374 |
| Total Thickness | 0.004" (0.102 mm) / 0.005" (0.127 mm) / 0.006" (0.152 mm) | ASTM D374 |
| Density (g/cm³) | 2.0 | ASTM D297 |
| Continuous Use Temperature (°C) | -45~125 | — |
| Electrical | ||
| Dielectric Breakdown Voltage (VAC) | >3000 / >3500 / >5000 | ASTM D149 |
| Dielectric Constant @1MHz | 3.8 | ASTM D150 |
| Volume Resistivity (Ω·m) | 3.5×10¹² | ASTM D257 |
| Thermal Conductivity (W/m·K) | 1.6 | ASTM D5470 |
| Thermal Impedance @50psi (°C·in²/W) | 0.12 / 0.16 / 0.21 | ASTM D5470 |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC800P-K1 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC800P-K1?
The customer workbook lists nominal through-plane conductivity as 1.6 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC800P-K1 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC800P-K1?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC800P-K1 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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