TIC820P Phase Change Material
- Density (g/cm³)
- 2.2
- Operating Temperature Ran…
- -25~125
- Thermal Conductivity (W/m·K)
- 0.95
- Thickness
- 0.50 mm
- Thickness Tolerance
- ±0.0020 / ±0.050 mm
- Color
- Pink
TIC820P — Product overview
TIC820P series is a low-melting-point phase change thermal interface material. At 50°C the material begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance. The product is a flexible solid at room temperature and freestanding without reinforcing components that would reduce thermal performance. It shows no thermal performance degradation after 1,000 hours at 130°C or after 500 thermal cycles from -25°C to 125°C, and the material softens but does not fully change state — resulting in minimal migration (no pump-out) at operating temperatures.
TIC820P — Features
Naturally tacky at room temperature
No adhesive required
No heat sink preheating required
Phase change at 50
Lowest reported thermal resistance
Stable after 1,000 hours @130°C and 500 cycles -25°C to 125°C
Flexible solid at room temperature without reinforcement
Where this grade is used
Typical application targets for this grade include High-frequency microprocessors, Notebook and desktop PCs, Computer servers, Memory modules, Cache chips.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIC820P — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIC820P产品规格书（英文版）.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Product Name | TIC™820P | — |
| Color | Pink | Visual |
| Thickness | 0.020" (0.50 mm) | — |
| Thickness Tolerance | ±0.0020 / ±0.050 | — |
| Density (g/cm³) | 2.2 | Helium Pycnometer |
| Operating Temperature Range (°C) | -25~125 | — |
| Phase Change Softening Temperature (°C) | 50~60 | — |
| Thermal Conductivity (W/m·K) | 0.95 | ASTM D5470 (modified) |
| Thermal Impedance @50psi (345 KPa) | 0.183 °C·in²/W / 1.18 °C·cm²/W | ASTM D5470 (modified) |
* Match values to the PDF revision cited on your purchase order.
Related phase change materials models
TIC820P — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIC820P?
The customer workbook lists nominal through-plane conductivity as 0.9 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIC820P die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Phase change materials parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIC820P?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIC820P RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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