TIG680-20AB — Silicone potting compounds (2 W/m·K nominal) — gallery view 1 of 1

TIG680-20AB Silicone Potting Compound

Breakdown Voltage (V/mm)
≥8000
Density (g/cm³)
2.6±0.1
Dielectric Constant @1MHz
5.0~7.0
Flame Rating
V-0
Hardness (Shore A)
35±5
Part A Viscosity (mPa·s)
7000±1000
Download TIG680-20AB datasheet (PDF)
Overview

TIG680-20AB — Product overview

TIG® 680-20AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable, long working time and fire resistance. It is especially suitable for capacitor, small electronic equipment sealing. Its flexible, elastic characteristics enable it to provide cushioning for the materials it is coated with. The lower viscosity allows the thermal potting adhesive to cover the surface more fully, greatly increasing the efficiency of heat transfer from the heating device or the entire PCB to the metal case or diffusion plate, thus improving the efficiency and service life of the electronic components.

Features

TIG680-20AB — Features

  • Good thermal conductive

  • Good insulation performance

  • Good elasticity

  • Lower shrinkage

  • Low viscosity, easy gas emissions

  • Good solvent resistance and waterproof performance

Typical applications

Where this grade is used

Typical application targets for this grade include Industrial control, transformer, coil, amplifier, high voltage package, relay, high current junction box, etc, Heat sink assembly, thermal sensor potting, thermal conductive product potting, Heat conduction between the battery cell and the cold tube, LED and power drive potting.

Technical specifications

TIG680-20AB — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIG680-20AB-Data-sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.

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TIG680-20ABdatasheet property table
ParameterValue (typical / as stated)Method / note
Material Properties (Before Curing)
Color/Part AWhiteVisual
Color/Part BGrayVisual
Part A Viscosity (mPa·s)7000±1000GB/T 10247
Part B Viscosity (mPa·s)7000±1000GB/T 10247
Mix Ratio1:1Ziitek Test Method
Shelf Life6 months (Unopened)Ziitek Test Method
Cure Schedule
Pot Life @25°C30~45 minsZiitek Test Method
Cure @70°C20~30 minsZiitek Test Method
Cure Material Properties
ColorGrayVisual
Hardness (Shore A)35±5ASTM D2240
Density (g/cm³)2.6±0.1ASTM D792
Recommended Operating Temp-45~200 °CZiitek Test Method
Flame RatingV-0UL 94
Thermal Conductivity (W/m·K)2.0±0.2ASTM D5470
Breakdown Voltage (V/mm)≥8000ASTM D149
Dielectric Constant @1MHz5.0~7.0ASTM D150
Volume Resistivity (Ω·cm)1.0×10¹⁴ASTM D257

* Match values to the PDF revision cited on your purchase order.

Same product family

Related silicone potting compounds models

Back to family overview
Modelλ (W/m·K)View
TIS680-10AB1 W/m·KDetails
TIS680-12AB1.2 W/m·KDetails
TIG680-15AB1.5 W/m·KDetails
TIS680-15AB1.5 W/m·KDetails
TIG680-28AB2.8 W/m·KDetails
TIS680-28AB2.8 W/m·KDetails
TIG680-30AB3 W/m·KDetails
TIS680-35AB3.5 W/m·KDetails
FAQ

TIG680-20AB — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIG680-20AB?

The customer workbook lists nominal through-plane conductivity as 2 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIG680-20AB die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Silicone potting compounds parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIG680-20AB?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIG680-20AB RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

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