TIS680-10AB Silicone Potting Compound
- Dielectric Breakdown Voltage
- 200 volts/mil
- Dielectric Constant @1MHz
- 4.5
- Hardness (Shore A) @25°C
- 65
- Operating temperature
- -40°C ~160°C
- Specific Gravity (g/cm³)
- 1.73
- Specific Gravity (g/cm³)
- 1.73
TIS680-10AB — Product overview
TIS™ 680-10AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. It is design for potting of capacitors and electrical devices. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
TIS680-10AB — Features
Good thermal conductive
Excellent insulation and smoothly sourface.
Low shrinkage
Low viscosity, expediting air releaseed.
Excellent in solvents and water proof.
Longer life time.
Where this grade is used
Typical application targets for this grade include To potting LED Lighting heat spreader and power-driver., Ferrite cements; tip type LED; good cementation to aromatic polyester, Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics, Power transformers and coils; Potting capacitors; Potting of small electrical devices, Adhesion to metal glass and plastic; LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant, Optical / medical component adhesive.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIS680-10AB — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIS680-10AB-Specification-sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Typical Uncured Material (Hardener) | ||
| Color | White | — |
| Viscosity @25°C Brookfield (mPa·s) | 3500 | — |
| Specific Gravity (g/cm³) | 1.73 | — |
| Shelf life @25°C in sealed container (months) | 6 | — |
| Typical Uncured Material (Resin) | ||
| Color | Black | — |
| Viscosity @25°C Brookfield (mPa·s) | 3500 | — |
| Shelf life @25°C in sealed container (months) | 6 | — |
| Mix Ratio (By weight) | ||
| Mix Ratio | 100 : 100 | — |
| Viscosity @25°C Brookfield (mPa·s) | 3500 | — |
| Specific Gravity (g/cm³) | 1.73 | — |
| Working pot life (250 g @25°C) | 30 mins | — |
| Cure Schedule | ||
| Cure at 25°C | 3 hrs | — |
| Cure at 70°C | 20 mins | — |
| Cured Properties | ||
| Hardness (Shore A) @25°C | 65 | ASTM D2240 |
| Operating temperature | -40°C ~160°C | — |
| Glass transition temperature Tg | 92°C | — |
| Elongation | 4.50% | ASTM D412 |
| Coefficient of thermal expansion | 3.0×10⁻⁵ /°C | — |
| Fire resistance UL | 94 V-0 | E331100 |
| Moisture absorption % wt gain 24 hours water immersion @25°C | < 0.1 | ASTM D570 |
| Thermal Conductivity (W/m·K) | 1.0 | ASTM D5470 |
| Thermal Impedance @10psi | 0.48 °C·in²/W | ASTM D5470 |
| Dielectric Breakdown Voltage | 200 volts/mil | ASTM D149 |
| Dielectric Constant @1MHz | 4.5 | ASTM D150 |
| Volume resistivity @25°C (Ω·cm) | 3.0×10¹³ | ASTM D257 |
* Match values to the PDF revision cited on your purchase order.
Related silicone potting compounds models
TIS680-10AB — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIS680-10AB?
The customer workbook lists nominal through-plane conductivity as 1 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIS680-10AB die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Silicone potting compounds parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIS680-10AB?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIS680-10AB RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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