TIS680-15AB — Silicone potting compounds (1.5 W/m·K nominal) — gallery view 1 of 3

TIS680-15AB Silicone Potting Compound

Dielectric Constant @1 MHz
4.2
Hardness @25°C
85 Shore D
Specific Gravity (g/cm³)
2.3
Specific Gravity (g/cm³)
2.3
Thermal Conductivity (W/m·K)
1.5
Viscosity @25°C Brookfiel…
4,000±1000
Download TIS680-15AB datasheet (PDF)
Overview

TIS680-15AB — Product overview

TIS™ 680-15AB is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. It is design for potting of capacitors and electrical devices. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

TIS680-15AB — Features

  • Good thermal conductive

  • Excellent insulation and smoothly sourface.

  • Low shrinkage

  • Low viscosity, expediting air releaseed.

  • Excellent in solvents and water proof.

  • Longer life time.

Typical applications

Where this grade is used

Typical application targets for this grade include To potting LED Lighting heat spreader and power-driver., Ferrite cements; tip type LED; good cementation to aromatic polyester, Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics, Power transformers and coils; Potting capacitors; Potting of small electrical devices, Adhesion to metal glass and plastic; LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant, Optical / medical component adhesive.

Technical specifications

TIS680-15AB — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIS680-15AB.-Specification-sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIS680-15ABdatasheet property table
ParameterValue (typical / as stated)
Typical Uncured Material (Hardener)
ColorWhite
Viscosity @25°C Brookfield (cPs)4,000±1000
Specific Gravity (g/cm³)2.3
Shelf life @25°C in sealed container (months)6
Typical Uncured Material (Resin)
ColorGray
Viscosity @25°C Brookfield (cPs)4,000±1000
Shelf life @25°C in sealed container (months)6
Mix Ratio (By weight)
Mix Ratio100 : 100
Working pot life (250 g @25°C)30 min
Specific Gravity (g/cm³)2.3
Cure Schedule
Cure3 hours at 25°C
Cure20 min at 70°C
Cured Properties
Hardness @25°C85 Shore D
Service temperature-40°C to +160°C
Glass transition temperature Tg92°C
Elongation4.50%
Coefficient of thermal expansion3.0×10⁻⁵ /°C
Fire resistance UL94 V-0
Moisture absorption % wt gain 24 hours water immersion @25°C< 0.1
Thermal
Thermal Conductivity (W/m·K)1.5
Thermal Impedance @10psi0.36 °C-in²/W
ELECTRICAL AS CURED
Dielectric Constant @1 MHz4.2
Dissipation factor @1 MHz0.029
Volume resistivity @25°C (Ω·cm)3.0×10¹³

* Match values to the PDF revision cited on your purchase order.

Same product family

Related silicone potting compounds models

Back to family overview
Modelλ (W/m·K)View
TIS680-10AB1 W/m·KDetails
TIS680-12AB1.2 W/m·KDetails
TIG680-15AB1.5 W/m·KDetails
TIG680-20AB2 W/m·KDetails
TIG680-28AB2.8 W/m·KDetails
TIS680-28AB2.8 W/m·KDetails
TIG680-30AB3 W/m·KDetails
TIS680-35AB3.5 W/m·KDetails
FAQ

TIS680-15AB — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIS680-15AB?

The customer workbook lists nominal through-plane conductivity as 1.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIS680-15AB die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Silicone potting compounds parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIS680-15AB?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIS680-15AB RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

Your next thermal solution
starts here.

From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 5,000+ clients across EV, 5G, and consumer electronics.