TIS680-28AB — Silicone potting compounds (2.8 W/m·K nominal) — gallery view 1 of 3

TIS680-28AB Silicone Potting Compound

Breakdown Voltage (V/mm)
≥10000
Density (g/cm³)
2.2
Dielectric Constant @1MHz
4.2
Flame Rating
V-0
Hardness (Shore A)
65
Part A Viscosity (mPa·s)
6000
Download TIS680-28AB datasheet (PDF)
Overview

TIS680-28AB — Product overview

TIS®680-28AB is a two-component potting adhesive. When Component A and Component B are mixed in a specific ratio, the adhesive can cure and form into shape either at room temperature or under heating conditions. After curing, it forms a dense elastomer with integrated performance characteristics: excellent thermal conductivity, electrical insulation, resistance to extreme temperatures, and anti-aging properties. It features low shrinkage rate, can closely adhere to various substrates, and effectively fills the gaps between electronic components. This product delivers comprehensive protection for electronic assemblies, including thermal conduction, insulation, waterproofing, shock absorption, flame retardancy, and mechanical safeguarding.

Features

TIS680-28AB — Features

  • Good thermal conductivity

  • Excellent electrical insulation performance

  • Controllable curing performance

  • Flexibly adjustable mechanical properties

  • Low viscosity facilitating gas release

  • Excellent solvent and water resistance

Technical specifications

TIS680-28AB — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIS680-28AB_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIS680-28ABdatasheet property table
ParameterValue (typical / as stated)Method / note
Material Properties (Before Curing)
Color/Part AWhiteVisual
Color/Part BWhiteVisual
Part A Viscosity (mPa·s)6000GB/T 10247
Part B Viscosity (mPa·s)6000GB/T 10247
Mix Ratio1:1-
Shelf Life (Month) @25°C12 (Unopened)-
Cure Schedule
Pot Life @25°C30 minsZiitek Test Method
Cure @25°C (hours)3Ziitek Test Method
Cure @70°C20 minsZiitek Test Method
Cure Material Properties
ColorWhiteVisual
Hardness (Shore A)65ASTM D2240
Density (g/cm³)2.2ASTM D792
Thermal Impedance @10 psi0.28 °C·in²/WASTM D5470
Thermal Conductivity (W/m·K)2.8ASTM D5470
Breakdown Voltage (V/mm)≥10000ASTM D149
Dielectric Constant @1MHz4.2ASTM D150
Volume Resistivity> 1.0×10¹³ Ω·cmASTM D257
Elongation at Break4.0 %ASTM D638
Water Absorption (% WT) @ 25°C, 24 h Immersion< 0.1ASTM D570
Recommended Operating Temperature-45~200 °C-
Flame RatingV-0UL 94

* Match values to the PDF revision cited on your purchase order.

Same product family

Related silicone potting compounds models

Back to family overview
Modelλ (W/m·K)View
TIS680-10AB1 W/m·KDetails
TIS680-12AB1.2 W/m·KDetails
TIG680-15AB1.5 W/m·KDetails
TIS680-15AB1.5 W/m·KDetails
TIG680-20AB2 W/m·KDetails
TIG680-28AB2.8 W/m·KDetails
TIG680-30AB3 W/m·KDetails
TIS680-35AB3.5 W/m·KDetails
FAQ

TIS680-28AB — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIS680-28AB?

The customer workbook lists nominal through-plane conductivity as 2.8 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIS680-28AB die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Silicone potting compounds parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIS680-28AB?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIS680-28AB RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

Your next thermal solution
starts here.

From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 5,000+ clients across EV, 5G, and consumer electronics.