TIA600FG Thermal Adhesive Tape
- Dielectric Breakdown Voltage
- >1000 VAC
- Flame Rating
- 94 V0
- Thermal Conductivity (W/m·K)
- 0.8
- Thickness range
- 0.0050"-0.010" mm
- 180° Peel Adhesion
- > 800 g/inch (Steel, Immediate)
- 180° Peel Adhesion
- > 800 g/inch (Steel after 24 hrs)
TIA600FG — Product overview
TIA™ 600FG Series are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
TIA600FG — Features
Thermal Conductivity
High performance, thermally conductive acrylic adhesive.
High bond strength to a variety of surfaces Double sided pressure sensitive adhesive tape.
Where this grade is used
Typical application targets for this grade include Fixed the radiator to the encapsulated chip, Fixed the radiator to the power supply circuit or vehicle control circuit board, Can replace hot melt glue, screw, fastener, etc. fixed mode.
TIA600FG — datasheet specifications
Values below are transcribed from the official datasheet (PDF: tia600fg.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | White | Visual |
| Adhesive Type | Acrylic Adhesive | — |
| Backing Type | Fiberglass | — |
| Operating Temp | -45°C-120°C | — |
| Thickness range | 0.0050"-0.010" | ASTM D374 |
| Dielectric Breakdown Voltage | >1000 VAC | ASTM D149 |
| Thermal Conductivity (W/m·K) | 0.8 | ASTM D5470 |
| 180° Peel Adhesion | > 800 g/inch (Steel, Immediate) | PSTC-1 |
| 180° Peel Adhesion | > 800 g/inch (Steel after 24 hrs) | PSTC-1 |
| Holding Power 25°C/Hours | > 48 Hours | PSTC-7 |
| Holding Power 80°C/Hours | > 48 Hours | PSTC-7 |
| Flame Rating | 94 V0 | UL E331100 |
* Match values to the PDF revision cited on your purchase order.
TIA600FG — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIA600FG?
The customer workbook lists nominal through-plane conductivity as 0.8 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIA600FG die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal tapes parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIA600FG?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIA600FG RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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