TIA800FG Thermal Adhesive Tape
- Thermal Conductivity (W/m·K)
- 0.8
- Thickness
- 0.127~0.508 mm
- Voltage Breakdown
- > 2500 Vac / > 3000 Vac / > 3500 Vac / …
- 180° Peel Adhesion
- > 1000 g/inch (Steel, Immediate)
- 180° Peel Adhesion
- > 1200 g/inch (Steel after 24 hrs)
- Adhesive Type
- Acrylic Adhesive
TIA800FG — Product overview
TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
TIA800FG — Features
Thermal Conductivity 0.8W/mK
High performance, thermally conductive acrylic adhesive.
High bond strength to a variety of surfaces Double sided pressure sensitive adhesive tape.
Where this grade is used
Typical application targets for this grade include Mount heat sink onto BGA graphic processor or drive processor., Mount heat spreader onto power converter PCB or onto motor control., Can be used instead of heat cure adhesive, screw mounting or clip mounting..
TIA800FG — datasheet specifications
Values below are transcribed from the official datasheet (PDF: tia800fg.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Product Name | TIA805FG / TIA806FG / TIA808FG / TIA810FG / TIA812FG / TIA815FG / TIA820FG | — |
| Color | White | Visual |
| Adhesive Type | Acrylic Adhesive | — |
| Backing Type | The glass fiber | — |
| Continuous Use Temp | -45°C to 120°C | — |
| Thickness | 0.005" (0.127mm) / 0.006" (0.152mm) / 0.008" (0.203mm) / 0.010" (0.254mm) / 0.012" (0.304mm) / 0.015" (0.381mm) / 0.020" (0.508mm) | ASTM D374 |
| Voltage Breakdown | > 2500 Vac / > 3000 Vac / > 3500 Vac / > 4000 Vac / > 4200 Vac / > 4500 Vac / > 5000 Vac | ASTM D149 |
| Thermal Conductivity (W/m·K) | 0.8 | ASTM D5470 |
| 180° Peel Adhesion | > 1000 g/inch (Steel, Immediate) | GB/T2792 |
| 180° Peel Adhesion | > 1200 g/inch (Steel after 24 hrs) | GB/T2792 |
| Holding Power (25°C/Hours) | > 48 Hours | GB/T4851 |
| Holding Power (80°C/Hours) | > 48 Hours | GB/T4851 |
* Match values to the PDF revision cited on your purchase order.
TIA800FG — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIA800FG?
The customer workbook lists nominal through-plane conductivity as 0.8 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIA800FG die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal tapes parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIA800FG?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIA800FG RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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