TIE380-25 — Thermal epoxy adhesives (2.5 W/m·K nominal) — gallery view 1 of 1

TIE380-25 Thermal Epoxy

Hardness
92 Shore A
Specific Gravity (g/cm³)
2.1
Thermal Conductivity (W/m·K)
2.5
Viscosity (cPs)
140,000
Appearance cured
Dull Gray Solid
Appearance uncured
Gray Paste
Download TIE380-25 datasheet (PDF)
Overview

TIE380-25 — Product overview

TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength. TIE™380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

Features

TIE380-25 — Features

  • Good thermal conductivity

  • Good maneuverability and adhesion performance

  • Low shrinkage

  • Low viscosity, easy-to-gas emissions

  • Good solvent resistance, water resistance

  • Longer working hours

Technical specifications

TIE380-25 — datasheet specifications

Values below are transcribed from the official datasheet (PDF: tie380-25.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIE380-25datasheet property table
ParameterValue (typical / as stated)Method / note
Application Features
ColorGray
Viscosity (cPs)140,000
Specific Gravity (g/cm³)2.1
Shelf life10 Days
Shelf life6 Months
Curing procedures3 Hours
Curing procedures1.5 Hour
Curing procedures20 Minutes
Curing procedures5 Minutes
Typical Properties
Chemical typeEpoxy
Appearance uncuredGray PasteVisual
Appearance curedDull Gray SolidVisual
ComponentsOne Component
Heat Capacity0.7 J/g-KASTM C351
Key SubstratesMetals, ceramics
Hardness92 Shore AASTM 2240
Continuous Use Temp-40 to 180 °C
Tensile strength Al/Al @25°C (psi)>2800
Thermal Conductivity (W/m·K)2.5ASTM D5470

* Match values to the PDF revision cited on your purchase order.

Same product family

Related thermal epoxy adhesives models

Back to family overview
Modelλ (W/m·K)View
TIE380-454.5 W/m·KDetails
FAQ

TIE380-25 — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIE380-25?

The customer workbook lists nominal through-plane conductivity as 2.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIE380-25 die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Thermal epoxy adhesives parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIE380-25?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIE380-25 RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

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