TIE380-45 Thermal Epoxy
- Density (g/cm³)
- 2.0
- Hardness (Shore A)
- 92
- Recommended Operating Tem…
- -40~200 °C
- Thermal Conductivity (W/m·K)
- 4.5
- Viscosity
- 15,000 cps
- Appearance (After Curing)
- Gray Solid
TIE380-45 — Product overview
TIE®380-45 is a single-component heat-curable modified epoxy resin adhesive containing high-purity thermally conductive fillers. It features high thermal conductivity, low shrinkage, high bonding strength, and excellent thermal shock resistance. Ready-to-use, it is suitable for automatic dispensing/screen printing. It is used for structural thermal conductive bonding, fixing, and potting of electronic components and heat sinks, improving heat dissipation efficiency and long-term reliability.
TIE380-45 — Features
High thermal conductivity
Single-component design, easy and efficient to use
Strong bonding performance and stable structure
Low shrinkage rate
Good thermal shock resistance
Where this grade is used
Typical application targets for this grade include Thermal conductive bonding for power electronic devices, LED lighting field, Encapsulation and fixing of precision electronic components, PCB board heat dissipation treatment, Thermal conductive bonding of core components of medical devices.
TIE380-45 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: tie380-45.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Typical Properties | ||
| Construction & Composition | Epoxy resin | - |
| Appearance (Before Curing) | Gray Paste | Visual |
| Appearance (After Curing) | Gray Solid | Visual |
| Component | Single Component | - |
| Viscosity | 15,000 cps | GB/T 10247 |
| Density (g/cm³) | 2.0 | ASTM D792 |
| Hardness (Shore A) | 92 | ASTM D2240 |
| Recommended Operating Temperature | -40~200 °C | - |
| Shear Strength (Al/Al) 25°C | >2900 psi | ASTM D1002 |
| Thermal Conductivity (W/m·K) | 4.5 | ASTM D5470 |
| Shelf Life (Day) @25°C | 10 (Unopened) | - |
| Shelf Life (Month) @0°C | 6 (Unopened) | - |
| Curing Conditions | ||
| Curing Temperature 100°C | Curing Time 4h | Ziitek Test Method |
| Curing Temperature 125°C | Curing Time 2h | Ziitek Test Method |
* Match values to the PDF revision cited on your purchase order.
Related thermal epoxy adhesives models
| Model | λ (W/m·K) | Hardness | View |
|---|---|---|---|
| TIE380-25 | 2.5 W/m·K | 92 Shore A | Details |
TIE380-45 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIE380-45?
The customer workbook lists nominal through-plane conductivity as 4.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIE380-45 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal epoxy adhesives parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIE380-45?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIE380-45 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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