TIF015-07 Thermal Gel
- Flame Rating
- V-0
- Specific Gravity (g/cm³)
- 2.5
- Thermal conductivity (W/m·K)
- 1.5
- Viscosity
- 4000 Pa·s
- Color
- Green
- Construction & Composition
- Ceramic filled silicon material
TIF015-07 — Product overview
TIF™015-07 is a soft silicone putty thermal gap filler, which blend with exclusive formula, that offer superior thermal performance, and compressibility. Due to TIF™015-07 is made by high vicosity silicon oil, that can prevent thermal formula seprate from it. Besides, compared with traditionally thermal pad, it can control bonded shifiting issue much better. TIF™015-07 operation mold is simliar as grease, such as silkprint and screen print or automatic injected facility. TIF™015-07 can be applied on chip micro processor, PPGAs, Micro BGA package, BGA package, DSP chip, LED lighting and other high power electric component.
TIF015-07 — Features
Thermal conductivity
Soft, very low compression
Low thermal inpedance
Operate automaticly
Proven long-term reliability
Where this grade is used
Typical application targets for this grade include Heat-sink & frame, LED backlight module，LED lighting, High speed hardware driver, Micro heat pipe, Vihicel enginee controler, Telecom industry, Semiconductor automatic laboratory equipment..
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIF015-07 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF015-07-TDS_EN_REV03.2.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Green | Visual |
| Construction & Composition | Ceramic filled silicon material | — |
| Viscosity | 4000 Pa·s | GB/T 10247 |
| Specific Gravity (g/cm³) | 2.5 | ASTM D297 |
| Thermal conductivity (W/m·K) | 1.5 | ISO 22007-2 |
| Thermal diffusivity | 0.847 mm²/s | ISO 22007-2 |
| Specific heat capacity | 2.2 MJ/m³K | ISO 22007-2 |
| Continuous Use Temperature | -45 ~200°C | Ziitek Test Method |
| Flame Rating | V-0 | UL94 |
* Match values to the PDF revision cited on your purchase order.
Related thermal putty and thermal gel models
TIF015-07 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF015-07?
The customer workbook lists nominal through-plane conductivity as 1.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF015-07 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal putty and thermal gel parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF015-07?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF015-07 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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