TIF020-19 Thermal Gel
- Bond Line Thickness
- 0.10 mm
- Breakdown Voltage (V/mm)
- ≥4000
- Density (g/cm³)
- 2.6
- Flame Rating
- V-0
- Recommended Operating Tem…
- -40~200 °C
- Thermal Conductivity (W/m·K)
- 2.0
TIF020-19 — Product overview
TIF®020-19 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both good thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment.
TIF020-19 — Features
Good Thermal conductivity
Soft, very low compression
Low thermal impedance
Operate automatically
Proven long-term reliability
Where this grade is used
Typical application targets for this grade include Heat-sink & frame, LED backlight module, LED lighting, High speed hardware driver, Micro heat pipe, Vihicel enginee controller, Telecom industry, Semiconductor automatic laboratory equipment.
TIF020-19 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF020-19_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Yellow | Visual |
| Construction | Ceramic filled silicon material | — |
| Flow Rate | 90 g/min | Ziitek Test Method |
| Density (g/cm³) | 2.6 | ASTM D792 |
| Thermal Conductivity (W/m·K) | 2.0 | ASTM D5470 |
| Thermal Impedance @10psi | 0.143 °C·in²/W | ASTM D5470 |
| Thermal Impedance @50psi | 0.114 °C·in²/W | ASTM D5470 |
| Recommended Operating Temperature | -40~200 °C | — |
| Breakdown Voltage (V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness | 0.10 mm | — |
| Flame Rating | V-0 | UL94 |
| Shelf Life | 12 Month | — |
* Match values to the PDF revision cited on your purchase order.
Related thermal putty and thermal gel models
TIF020-19 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF020-19?
The customer workbook lists nominal through-plane conductivity as 2 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF020-19 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal putty and thermal gel parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF020-19?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF020-19 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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