TIF030-11-1 Thermal Gel
- Density (g/cm³)
- 3.1
- Dielectric Constant @1MHz
- 8.0
- Dielectric Strength (kV/mm)
- ≥11.5
- Flame Rating
- V-0
- Thermal Conductivity (W/m·K)
- 3.0
- Volume Resistivity (Ω·cm)
- 4.0×10¹⁴
TIF030-11-1 — Product overview
TIF®030-11-1 is a single-part thermally conductive silicone paste with excellent interface thermal-resistance characteristics and outstanding plasticity, capable of meeting strict thermal-management requirements across a wide range of designs. The material has extremely low hardness and free-forming ability, making it easy to apply and assemble, while delivering good stability in high-temperature environments. Its low-stress nature is particularly suited to electronic devices requiring high precision and reliability, effectively reducing mechanical stress on sensitive components during assembly and operation.
TIF030-11-1 — Features
Thermal conductivity 3.0 W/m·K
Low stress
Protects sensitive components
Strong plasticity with good stability
Superior dielectric properties
Single-part dispense and use
No curing required
Where this grade is used
Typical application targets for this grade include Power modules, LED backlight modules and LED lighting, High-speed hardware drivers, Micro heat pipes, Vehicle engine controllers, Telecom industry equipment, Semiconductor automatic laboratory equipment.
TIF030-11-1 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF030-11-1_Data-sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Dark Gray | Visual |
| Construction & Composition | Ceramic filled silicone material | — |
| Density (g/cm³) | 3.1 | ASTM D792 |
| Thermal Conductivity (W/m·K) | 3.0 | ASTM D5470 |
| Dielectric Strength (kV/mm) | ≥11.5 | ASTM D149 |
| Dielectric Constant @1MHz | 8.0 | ASTM D5470 |
| Volume Resistivity (Ω·cm) | 4.0×10¹⁴ | ASTM D257 |
| Flame Rating | V-0 | UL94 (E331100) |
* Match values to the PDF revision cited on your purchase order.
Related thermal putty and thermal gel models
TIF030-11-1 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF030-11-1?
The customer workbook lists nominal through-plane conductivity as 3 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF030-11-1 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal putty and thermal gel parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF030-11-1?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF030-11-1 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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