TIF035-05 Thermal Gel
- Bond Line Thickness (mm)
- 0.10 mm
- Density (g/cm³)
- 3.25
- Dielectric Strength (V/mm)
- ≥4000
- Flame Rating
- V-0
- Thermal Conductivity (W/m·K)
- 3.5
- Color
- Blue
TIF035-05 — Product overview
TIF®035-05 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®035-05 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronic components.
TIF035-05 — Features
Thermal conductivity
Soft, very low compression
Low thermal impedance
Operate automatically
Proven long-term reliability
Where this grade is used
Typical application targets for this grade include Heat-sink & frame, LED backlight module, LED lighting, High speed hardware driver, Micro heat pipe, Vihicel enginee controller, Telecom industry, Semiconductor automatic laboratory equipment.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIF035-05 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF035-05-Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Blue | Visual |
| Construction & Composition | Ceramic filled silicon material | — |
| Flow Rate (g/min) | 30 | Ziitek Test Method (30 cc syringe / 2.5 mm orifice / 90 psi) |
| Density (g/cm³) | 3.25 | ASTM D297 |
| Thermal Conductivity (W/m·K) | 3.5 | ASTM D5470 |
| Thermal Impedance @10psi (°C·in²/W) | 0.080 | ASTM D5470 |
| Thermal Impedance @50psi (°C·in²/W) | 0.075 | ASTM D5470 |
| Recommended Operating Temp (°C) | -45~200 | Ziitek Test Method |
| Dielectric Strength (V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness (mm) | 0.10 | Ziitek Test Method |
| Flame Rating | V-0 | UL94 |
| Shelf Life (months) | 12 | — |
* Match values to the PDF revision cited on your purchase order.
Related thermal putty and thermal gel models
TIF035-05 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF035-05?
The customer workbook lists nominal through-plane conductivity as 3.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF035-05 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal putty and thermal gel parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF035-05?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF035-05 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
Your next thermal solution
starts here.
From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 5,000+ clients across EV, 5G, and consumer electronics.