TIF040-12 Thermal Gel
- Bond Line Thickness (mm)
- 0.20 mm
- Density (g/cm³)
- 3.20
- Dielectric Strength (V/mm)
- ≥4000
- Flame Rating
- V-0
- Recommended Operating Tem…
- -45~200
- Thermal Conductivity (W/m·K)
- 4.0
TIF040-12 — Product overview
TIF®040-12 is a soft single-part silicone gel-based gap filler formulated with a special blend of fillers that combines excellent thermal conductivity with superior softness. Compared to conventional thermal greases its higher viscosity prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. Apply it like a thermal grease using commercial dispensing tools or automated equipment — there is no cure step. Typical applications include flip-chip microprocessors, PPGAs, micro BGA and BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronics.
TIF040-12 — Features
Thermal conductivity 4.0 W/m·K
Soft with very low compression force
Low thermal impedance
Single-part dispense and use
No curing required
Compatible with automated dispensing
Proven long-term reliability
Where this grade is used
Typical application targets for this grade include Heat sinks and frames, LED backlight modules and LED lighting, High-speed hardware drivers, Micro heat pipes, Vehicle engine controllers, Telecom industry equipment, Semiconductor automatic laboratory equipment.
TIF040-12 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF040-12_Data-sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Blue | Visual |
| Construction & Composition | Ceramic filled silicone material | — |
| Flow Rate (g/min, 30 cc syringe / 2.5 mm orifice / 90 psi) | 60 | Ziitek Test Method |
| Density (g/cm³) | 3.20 | ASTM D792 |
| Thermal Conductivity (W/m·K) | 4.0 | ASTM D5470 |
| Thermal Impedance @10psi (°C·in²/W) | 0.093 | ASTM D5470 |
| Thermal Impedance @50psi (°C·in²/W) | 0.086 | ASTM D5470 |
| Recommended Operating Temperature (°C) | -45~200 | Ziitek Test Method |
| Dielectric Strength (V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness (mm) | 0.20 | Ziitek Test Method |
| Flame Rating | V-0 | UL94 |
| Shelf Life (months) | 12 | — |
* Match values to the PDF revision cited on your purchase order.
Related thermal putty and thermal gel models
TIF040-12 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF040-12?
The customer workbook lists nominal through-plane conductivity as 4 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF040-12 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal putty and thermal gel parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF040-12?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF040-12 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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