TIF050-WA Thermal Gel
- Bond Line Thickness
- 0.15 mm
- Density (g/cm³)
- 3.6
- Flame Rating
- V-0
- Recommended Operating Tem…
- -40~200 °C
- Thermal Conductivity (W/m·K)
- 5.0
- Color
- Gray
TIF050-WA — Product overview
TIF®050-WA is a one-component thermally conductive and wave-absorbing gel engineered for high-performance equipment. It delivers excellent EMI suppression performance alongside superior thermal conductivity, making it ideal for applications requiring simultaneous electromagnetic wave absorption and heat dissipation. Its gel form ensures exceptional application flexibility and gap adaptability, as well as outstanding compressibility and conformability. The product is compatible with large-scale, automated dispensing processes, and is especially suitable for irregular surfaces and gap-filling scenarios.
TIF050-WA — Features
Integrated thermal conductivity and wave absorption dual functions
Highly flexible silicone gel material
High-viscosity stable system, no filler migration
Easy for automated operation of dispensing systems
Long-term reliability
Where this grade is used
Typical application targets for this grade include RF modules for Routers / Switches, RF chips in smartphones, Tablets and Laptops, Battery management system for new energy vehicles, Power modules and Industrial control motherboards, Lasers, Sensors and High-speed transmission interfaces.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIF050-WA — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF050-WA_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Gray | Visual |
| Construction | Ceramic and magnetic powder-filled silicone materials | - |
| Flow Rate | 35 g/min | - |
| Density (g/cm³) | 3.6 | ASTM D792 |
| Thermal Conductivity (W/m·K) | 5.0 | ASTM D5470 |
| Thermal Impedance @10psi | 0.08 °C·in²/W | ASTM D5470 |
| Thermal Impedance @50psi | 0.07 °C·in²/W | ASTM D5470 |
| Recommended Operating Temperature | -40~200 °C | - |
| Bond Line Thickness | 0.15 mm | - |
| Flame Rating | V-0 | UL94 |
| Shelf Life | 12 (Unopened) Month | - |
* Match values to the PDF revision cited on your purchase order.
Related thermal putty and thermal gel models
TIF050-WA — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF050-WA?
The customer workbook lists nominal through-plane conductivity as — W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF050-WA die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal putty and thermal gel parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF050-WA?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF050-WA RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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