TIF050AB-WA — Thermal putty and thermal gel (— W/m·K nominal) — gallery view 1 of 2

TIF050AB-WA Thermal Gel

Bond Line Thickness (mm)
0.15 mm
Density (g/cm³)
3.6
Flame Rating
V-0
Hardness (Shore OO)
60
Part A Viscosity (mPa·s)
6,000,000
Part B Viscosity (mPa·s)
6,000,000
Download TIF050AB-WA datasheet (PDF)
Overview

TIF050AB-WA — Product overview

TIF®050AB-WA is a two-component thermally conductive and wave-absorbing gel designed for high-performance equipment. It delivers excellent EMI suppression while boasting superior thermal conductivity, making it ideal for applications requiring simultaneous electromagnetic interference absorption and heat dissipation. Its gel form ensures exceptional application flexibility and gap adaptability, along with outstanding compressibility and conformability. The product is compatible with large-scale, automated dispensing processes, and is especially suitable for irregular surfaces and gap scenarios.

Features

TIF050AB-WA — Features

  • Integrated thermal conductivity and wave absorption dual functions

  • Highly flexible silicone gel material

  • High-viscosity stable system, no filler migration

  • Easy for automated operation of dispensing systems

  • Long-term reliability

Technical specifications

TIF050AB-WA — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIF050AB-WA_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIF050AB-WAdatasheet property table
ParameterValue (typical / as stated)Method / note
Uncured Material Properties
ConstructionCeramic and magnetic powder-filled silicone materials
Color/Part AGrayVisual
Color/Part BGrayVisual
Part A Viscosity (mPa·s)6,000,000GB/T 10247
Part B Viscosity (mPa·s)6,000,000GB/T 10247
Bond Line Thickness (mm)0.15
Mix Ratio1:1
Shelf Life (Month)12 (Unopened)
Cure Schedule
Pot Life @ 25°C30 minsZiitek Test Method
Cure @ 25°C (hours)2-4Ziitek Test Method
Cure @ 100°C30 minsZiitek Test Method
Cure Material Properties
ColorGrayVisual
Hardness (Shore OO)60ASTM D2240
Density (g/cm³)3.6ASTM D792
Thermal Resistance @10psi (°C·in²/W)0.08ASTM D5470
Thermal Resistance @50psi (°C·in²/W)0.07ASTM D5470
Thermal Conductivity (W/m·K)5.0ASTM D5470
Recommended Operating Temperature (°C)-40~200
Flame RatingV-0UL 94

* Match values to the PDF revision cited on your purchase order.

Same product family

Related thermal putty and thermal gel models

Back to family overview
Modelλ (W/m·K)View
TIF030-WA3.0 W/m·KDetails
TIF030AB-WA3.0 W/m·KDetails
TIF050-WA5.0 W/m·KDetails
TIF015-071.5 W/m·KDetails
TIF015AB-07S1.5 W/m·KDetails
TIF020-192 W/m·KDetails
TIF020AB-19S2 W/m·KDetails
TIF020AB-23S-D2 W/m·KDetails
FAQ

TIF050AB-WA — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIF050AB-WA?

The customer workbook lists nominal through-plane conductivity as — W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIF050AB-WA die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Thermal putty and thermal gel parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIF050AB-WA?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIF050AB-WA RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

Your next thermal solution
starts here.

From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 5,000+ clients across EV, 5G, and consumer electronics.