TIF080-11 Thermal Gel
- Bond Line Thickness (mm)
- 0.2 mm
- Breakdown Voltage (V/mm)
- ≥4000
- Density (g/cm³)
- 3.4
- Flame Rating
- V-0
- Recommended Operating Tem…
- -40~200
- Thermal Conductivity (W/m·K)
- 8.0
TIF080-11 — Product overview
TIF®080-11 is a soft single-part silicone gel-based gap filler formulated with a special blend of fillers that combines excellent thermal conductivity (8.0 W/m·K) with superior softness. Compared to conventional thermal greases its higher viscosity prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. Apply it like a thermal grease using commercial dispensing tools or automated equipment — there is no cure step.
TIF080-11 — Features
Excellent thermal conductivity 8.0 W/m·K
Soft with very low compression force
Low thermal impedance
Single-part dispense and use
No curing required
Compatible with automated dispensing
Proven long-term reliability
Where this grade is used
Typical application targets for this grade include Heat sinks and frames, LED backlight modules and LED lighting, High-speed hardware drivers, Micro heat pipes, Vehicle engine controllers, Telecom industry equipment, Semiconductor automatic laboratory equipment.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIF080-11 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF080-11_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone material | — |
| Flow Rate (g/min, 30 cc syringe / 2.5 mm orifice / 90 psi) | 40 | Ziitek Test Method |
| Density (g/cm³) | 3.4 | ASTM D792 |
| Thermal Conductivity (W/m·K) | 8.0 | ASTM D5470 |
| Thermal Impedance @10psi (°C·in²/W) | 0.065 | ASTM D5470 |
| Thermal Impedance @50psi (°C·in²/W) | 0.060 | ASTM D5470 |
| Recommended Operating Temperature (°C) | -40~200 | — |
| Breakdown Voltage (V/mm) | ≥4000 | ASTM D149 |
| Bond Line Thickness (mm) | 0.2 | — |
| Flame Rating | V-0 | UL94 |
| Shelf Life (months) | 12 | — |
* Match values to the PDF revision cited on your purchase order.
Related thermal putty and thermal gel models
TIF080-11 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF080-11?
The customer workbook lists nominal through-plane conductivity as 8 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF080-11 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal putty and thermal gel parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF080-11?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF080-11 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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