TIF080AB-11S Thermal Gel
- Bond line Thickness
- 0.2 mm
- Density (g/cm³)
- 3.4
- Flame Rating
- V-0
- Hardness
- 45 Shore OO
- Thermal Conductivity (W/m·K)
- 8.0
- Volume Resistivity
- > 1.0×10¹² Ω·cm
TIF080AB-11S — Product overview
TIF080® AB-11S is a highly thermal conductive, liquid gap filling material. It is provided with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices module. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and lifetime of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual di-cut and specific pad thickness. Different from grease, the cured product is dry and can be touched. It can intented for use in thermal applications.
TIF080AB-11S — Features
Good thermal conductivity
Two-part formulation for easy storage
Excellent low and high temperature mechanical and chemical stability
Ultra-conforming low-stress interface application
Ambient or accelerated cure schedules
Optimized shear thinning characteristics for ease of dispensing
Where this grade is used
Typical application targets for this grade include Computer and peripherals, Telecommunications, Automotive electronics, Thermally conductive vibration dampening, Heat sink and any heat generating semicondutor.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIF080AB-11S — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF080AB-11S-TDS-EN.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Typical Uncured Material | ||
| Color/Part A | white | Visual |
| Color/Part B | gray | Visual |
| Flow Rate | 4.5 g/min | — |
| Density (g/cm³) | 3.4 | ASTM D792 |
| Bond line Thickness | 0.2 mm | ASTM D374 |
| Mix Ratio | 1:1 | — |
| Shelf Life (months) | 6 | — |
| Cure Schedule | ||
| Pot Life | 30 mins | — |
| Cure | 120 mins | — |
| Cure | 30 mins | — |
| Cure Properties | ||
| Color | gray | Visual |
| Hardness | 45 Shore OO | ASTM D2240 |
| Suggested Temp Range | -45 ~ 200 °C | — |
| Voltage Strength (V/mm) | ≥4000 | ASTM D149 |
| Volume Resistivity | > 1.0×10¹² Ω·cm | ASTM D257 |
| Flame Rating | V-0 | UL 94 |
| Thermal Conductivity (W/m·K) | 8.0 | ASTM D5470 |
| Thermal impedance | 0.72 °C-in²/W | ASTM D5470 |
| Thermal impedance | 0.60 °C-in²/W | ASTM D5470 |
* Match values to the PDF revision cited on your purchase order.
Related thermal putty and thermal gel models
TIF080AB-11S — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF080AB-11S?
The customer workbook lists nominal through-plane conductivity as 8 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF080AB-11S die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal putty and thermal gel parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF080AB-11S?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF080AB-11S RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
Your next thermal solution
starts here.
From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 5,000+ clients across EV, 5G, and consumer electronics.