TI500-65-11US Silicone Thermal Pad
- Breakdown Voltage (V/mm)
- ≥5500
- Density (g/cm³)
- 3.45
- Dielectric Constant @1MHz
- 7.0
- Flame Rating
- V-0
- Hardness (Shore OO)
- 20~65
- Recommended Operating Tem…
- -40~200
TI500-65-11US — Product overview
TIF®500-65-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.
TI500-65-11US — Features
High thermal conductivity
Super soft and highly compliant
Self-adhesive without the need for additional surface adhesives
Good insulation performance
Where this grade is used
Typical application targets for this grade include Power tools, Network communication products, Electric vehicle batteries, Computer CPU/GPU Cooling, New energy vehicle power systems.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
TI500-65-11US — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF500-65-11US_Data-sheet..pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Dark Gray | Visual |
| Construction | Ceramic filled silicone elastomer | — |
| Thickness Range | 0.010~0.020" (0.25~0.50 mm) / 0.030~0.200" (0.75~5.00 mm) | ASTM D374 |
| Hardness (Shore OO) | 65 / 20 | ASTM D2240 |
| Density (g/cm³) | 3.45 | ASTM D792 |
| Recommended Operating Temperature (°C) | -40~200 | — |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 7.0 | ASTM D150 |
| Volume Resistivity (Ω·cm) | >1.0×10¹² | ASTM D257 |
| Thermal Conductivity (W/m·K) | 6.5 | ASTM D5470 |
| Thermal Conductivity (W/m·K) | 6.5 | — |
| Flame Rating | V-0 | UL94 (E331100) |
* Match values to the PDF revision cited on your purchase order.
Related silicone thermal pads models
| Model | Series | λ (W/m·K) | Hardness | View |
|---|---|---|---|---|
| TIF100-10-02S | TIF100 | 1 W/m·K | 45 | Details |
| TIF100-12-66U | TIF100 | 1.2 W/m·K | 27~65 | Details |
| TIF100-15-11U | TIF100 | 1.5 W/m·K | 27~65 | Details |
| TIF100-18-02S | TIF100 | 1.8 W/m·K | 45~65 | Details |
| TIF500-18-11US | TIF500 | 1.8 W/m·K | 20~65 | Details |
| TIF100-20-05E | TIF100 | 2 W/m·K | 35~65 | Details |
| TIF200-20-14S | TIF200 | 2 W/m·K | 45±5 | Details |
| TIF400 | TIF400 | 2 W/m·K | 45 | Details |
TI500-65-11US — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TI500-65-11US?
The customer workbook lists nominal through-plane conductivity as 6.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TI500-65-11US die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TI500-65-11US?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TI500-65-11US RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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