TIF100-10055-50 — Silicone thermal pads (10 W/m·K nominal) — gallery view 1 of 5

TIF100-10055-50 Silicone Thermal Pad

Breakdown Voltage (V/mm)
≥5500
Density (g/cm³)
3.4
Dielectric Constant @1MHz
8.5
Flame Rating
V-0
Hardness (Shore OO)
55~70
Recommended Operating Tem…
-40~200
Download TIF100-10055-50 datasheet (PDF)
Overview

TIF100-10055-50 — Product overview

TIF®100 10055-50 Series a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Features

TIF100-10055-50 — Features

  • Excellent thermal conductivity

  • Good flexibility and fillability

  • Self-adhesive without the need for additional surface adhesives

  • Good insulation performance

Technical specifications

TIF100-10055-50 — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIF100-10055-50_Date-sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIF100-10055-50datasheet property table
ParameterValue (typical / as stated)Method / note
ColorPinkVisual
ConstructionCeramic filled silicone elastomer
Thickness Range0.020~0.030" (0.50~0.75 mm) / 0.040~0.200" (1.00~5.00 mm)ASTM D374
Hardness (Shore OO)70 / 55ASTM D2240
Density (g/cm³)3.4ASTM D792
Recommended Operating Temperature (°C)-40~200
Breakdown Voltage (V/mm)≥5500ASTM D149
Dielectric Constant @1MHz8.5ASTM D150
Volume Resistivity (Ω·cm)>1.0×10¹⁴ASTM D257
Thermal Conductivity (W/m·K)10.0ASTM D5470
Thermal Conductivity (W/m·K)10.0
Flame RatingV-0UL94 (E331100)

* Match values to the PDF revision cited on your purchase order.

Same product family

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Modelλ (W/m·K)View
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TIF500-18-11US1.8 W/m·KDetails
TIF100-20-05E2 W/m·KDetails
TIF200-20-14S2 W/m·KDetails
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FAQ

TIF100-10055-50 — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIF100-10055-50?

The customer workbook lists nominal through-plane conductivity as 10 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIF100-10055-50 die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIF100-10055-50?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIF100-10055-50 RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

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