TIF100-80-11F — Silicone thermal pads (8 W/m·K nominal) — gallery view 1 of 5

TIF100-80-11F Silicone Thermal Pad

Breakdown Voltage (V/mm)
≥5500
Density (g/cm³)
3.45
Dielectric Constant @1MHz
4.5
Flame Rating
V-0
Hardness (Shore OO)
60
Recommended Operating Tem…
-40~200
Download TIF100-80-11F datasheet (PDF)
Overview

TIF100-80-11F — Product overview

TIF®100-80-11F Series is a high-end compressible thermal pad designed to meet top-level cooling requirements while maintaining excellent assembly workmanship. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by ultra-high heat flux densities, while also providing good mechanical strength and compressibility, making it easy to process and install. It offers a reliable interface material solution with both outstanding thermal performance and high reliability for high-power-density electronic devices.

Features

TIF100-80-11F — Features

  • Excellent thermal conductivity

  • Good flexibility and fillability

  • Self-adhesive without the need for additional surface adhesives

  • Good insulation performance

Technical specifications

TIF100-80-11F — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIF100-80-11F_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIF100-80-11Fdatasheet property table
ParameterValue (typical / as stated)Method / note
ColorDark GrayVisual
ConstructionCeramic filled silicone elastomer
Thickness Range0.010~0.020" (0.25~0.50 mm) / 0.030~0.200" (0.75~5.00 mm)ASTM D374
Hardness (Shore OO)60ASTM D2240
Density (g/cm³)3.45ASTM D792
Recommended Operating Temperature (°C)-40~200
Breakdown Voltage (V/mm)≥5500ASTM D149
Dielectric Constant @1MHz4.5ASTM D150
Volume Resistivity (Ω·cm)>1.0×10¹²ASTM D257
Thermal Conductivity (W/m·K)8.0ASTM D5470 / ISO22007
Flame RatingV-0UL94 (E331100)

* Match values to the PDF revision cited on your purchase order.

Same product family

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Modelλ (W/m·K)View
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TIF500-18-11US1.8 W/m·KDetails
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FAQ

TIF100-80-11F — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIF100-80-11F?

The customer workbook lists nominal through-plane conductivity as 8 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIF100-80-11F die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIF100-80-11F?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIF100-80-11F RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

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