TIF500-50-11ES — Silicone thermal pads (5 W/m·K nominal) — gallery view 1 of 3

TIF500-50-11ES Silicone Thermal Pad

Breakdown Voltage (V/mm)
≥5000
Density (g/cm³)
3.3
Dielectric Constant @1MHz
3.8
Flame Rating
V-0
Hardness (Shore OO)
10
Recommended Operating Tem…
-40~200
Download TIF500-50-11ES datasheet (PDF)
Overview

TIF500-50-11ES — Product overview

TIF®500-50-11ES is a thermal pad specifically designed to address the most demanding thermal challenges and highly sensitive mechanical stress environments. Combining exceptional thermal conductivity with near-fluid softness, it ensures perfect filling of contact interfaces even under ultra-low installation pressure, completely eliminating air thermal resistance. This delivers an outstanding thermal management solution and physical protection for the most precise and high-heat-flux-density electronic components.

Features

TIF500-50-11ES — Features

  • High thermal conductivity

  • Extremely soft, low compression stress effectively protects sensitive components

  • Self adhesive without the need for additional surface adhesive

  • Good insulation performance

Technical specifications

TIF500-50-11ES — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIF500-50-11ES_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIF500-50-11ESdatasheet property table
ParameterValue (typical / as stated)Method / note
ColorGrayVisual
ConstructionCeramic filled silicone elastomer
Thickness Range0.02~0.03" (0.50~0.75 mm) / 0.04~0.20" (1.00~5.00 mm)ASTM D374
Hardness (Shore OO)10ASTM D2240
Density (g/cm³)3.3ASTM D792
Recommended Operating Temperature (°C)-40~200
Breakdown Voltage (V/mm)≥5000ASTM D149
Dielectric Constant @1MHz3.8ASTM D150
Volume Resistivity (Ω·cm)>1.0×10¹²ASTM D257
Thermal Conductivity (W/m·K)5.0ASTM D5470 / ISO22007
Flame RatingV-0UL94 (E331100)

* Match values to the PDF revision cited on your purchase order.

Same product family

Related silicone thermal pads models

Back to family overview
Modelλ (W/m·K)View
TIF100-10-02S1 W/m·KDetails
TIF100-12-66U1.2 W/m·KDetails
TIF100-15-11U1.5 W/m·KDetails
TIF100-18-02S1.8 W/m·KDetails
TIF500-18-11US1.8 W/m·KDetails
TIF100-20-05E2 W/m·KDetails
TIF200-20-14S2 W/m·KDetails
TIF4002 W/m·KDetails
FAQ

TIF500-50-11ES — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIF500-50-11ES?

The customer workbook lists nominal through-plane conductivity as 5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIF500-50-11ES die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIF500-50-11ES?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIF500-50-11ES RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

Your next thermal solution
starts here.

From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 5,000+ clients across EV, 5G, and consumer electronics.