TIF700HQ — Silicone thermal pads (8 W/m·K nominal) — gallery view 1 of 2

TIF700HQ Silicone Thermal Pad

Density (g/cm³)
3.5
Dielectric Breakdown Volt…
≥5500
Dielectric Constant @1MHz
5.0
Flame Rating
94 -V0
Hardness (Shore 00)
45±5 (Thickness ≥1.0mm) / 55±5 (Thickne…
Thermal Conductivity (W/m·K)
8.0
Download TIF700HQ datasheet (PDF)
Overview

TIF700HQ — Product overview

TIF™700HQ Series thermally conductive interface materials are applied to fill the air gaps between heat-generating components and the heat dissipation fins or metal base. Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat transfers to the metal housing or dissipation plate from the heat-generating components or the entire PCB, effectively enhancing the efficiency and service life of heat-generating electronic components.

Features

TIF700HQ — Features

  • Good thermal conductivity

  • Naturally tacky needing no further adhesive coating

  • Soft and Compressible for low stress applications

  • Available in varies thickness

Technical specifications

TIF700HQ — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIF700HQ-Series-Datasheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIF700HQdatasheet property table
ParameterValue (typical / as stated)Method / note
ColorGrayVisual
ConstructionCeramic filled silicone elastomer
Thickness range0.020"(0.5mm)~0.200" (5.0mm)ASTM D374
Hardness (Shore 00)45±5 (Thickness ≥1.0mm) / 55±5 (Thickness <1.0mm)ASTM 2240
Density (g/cm³)3.5ASTM D792
Operating Temp-40~160°C
Dielectric Breakdown Voltage (T=1.0mm, Vac)≥5500ASTM D149
Dielectric Constant @1MHz5.0ASTM D150
Volume Resistivity (Ω·cm)≥1.0×10¹²ASTM D257
Thermal Conductivity (W/m·K)8.0ASTM D5470 / ISO22007-2.2
Flame Rating94 -V0

* Match values to the PDF revision cited on your purchase order.

Same product family

Related silicone thermal pads models

Back to family overview
Modelλ (W/m·K)View
TIF100-10-02S1 W/m·KDetails
TIF100-12-66U1.2 W/m·KDetails
TIF100-15-11U1.5 W/m·KDetails
TIF100-18-02S1.8 W/m·KDetails
TIF500-18-11US1.8 W/m·KDetails
TIF100-20-05E2 W/m·KDetails
TIF200-20-14S2 W/m·KDetails
TIF4002 W/m·KDetails
FAQ

TIF700HQ — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIF700HQ?

The customer workbook lists nominal through-plane conductivity as 8 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIF700HQ die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIF700HQ?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIF700HQ RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

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