TIF800QE — Silicone thermal pads (13 W/m·K nominal) — gallery view 1 of 5

TIF800QE Silicone Thermal Pad

Breakdown Voltage (V/mm)
≥5500
Density (g/cm³)
3.5
Dielectric Constant @1MHz
8.0
Flame Rating
V-0
Hardness (Shore OO)
35~55
Recommended Operating Tem…
-40~200
Download TIF800QE datasheet (PDF)
Overview

TIF800QE — Product overview

TIF®800QE Serise is a high-end compressible thermal pad that meets top-level cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by extremely high heat fluxes, while also possessing good mechanical strength and compressibility, making it easy to manufacture and install. It provides a thermal interface material solution with both outstanding heat dissipation performance and high reliability for high-power-density electronic devices.

Features

TIF800QE — Features

  • Excellent thermal conductivity

  • Good softness and filling properties

  • Self-adhesive without the need for additional surface adhesive

  • Good insulation performance

Technical specifications

TIF800QE — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIF800QE_Data-Sheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIF800QEdatasheet property table
ParameterValue (typical / as stated)Method / note
ColorGrayVisual
ConstructionCeramic filled silicone elastomer
Thickness Range0.020~0.030" (0.50~0.75 mm) / 0.040~0.200" (1.00~5.00 mm)ASTM D374
Hardness (Shore OO)55 / 35ASTM D2240
Density (g/cm³)3.5ASTM D792
Recommended Operating Temperature (°C)-40~200
Breakdown Voltage (V/mm)≥5500ASTM D149
Dielectric Constant @1MHz8.0ASTM D150
Volume Resistivity (Ω·cm)>1.0×10¹²ASTM D257
Thermal Conductivity (W/m·K)13.0ASTM D5470
Thermal Conductivity (W/m·K)13.0
Flame RatingV-0UL94 (E331100)

* Match values to the PDF revision cited on your purchase order.

Same product family

Related silicone thermal pads models

Back to family overview
Modelλ (W/m·K)View
TIF100-10-02S1 W/m·KDetails
TIF100-12-66U1.2 W/m·KDetails
TIF100-15-11U1.5 W/m·KDetails
TIF100-18-02S1.8 W/m·KDetails
TIF500-18-11US1.8 W/m·KDetails
TIF100-20-05E2 W/m·KDetails
TIF200-20-14S2 W/m·KDetails
TIF4002 W/m·KDetails
FAQ

TIF800QE — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIF800QE?

The customer workbook lists nominal through-plane conductivity as 13 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIF800QE die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIF800QE?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIF800QE RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

Your next thermal solution
starts here.

From rapid prototyping to full-scale production — our engineers are ready to design a custom thermal solution for your application. Trusted by 5,000+ clients across EV, 5G, and consumer electronics.