TIF800Z — Silicone thermal pads (11 W/m·K nominal) — gallery view 1 of 5

TIF800Z Silicone Thermal Pad

Dielectric Breakdown Voltage
>4000 VAC
Dielectric Constant @1MHz
5.5
Flame Rating
94-V0
Hardness (thickness>0.75mm)
55 Shore00
Hardness (thickness≤0.75mm)
75 Shore00
Specific Gravity (g/cm³)
3.5 g/cm³
Download TIF800Z datasheet (PDF)
Overview

TIF800Z — Product overview

TIF™ 800Z Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and lifetime of the heat-generating electronic components.

Features

TIF800Z — Features

  • Good thermal conductivity

  • Naturally tacky needing no further adhesive coating

  • Soft and Compressible for low stress applications

  • Available in varies thickness

Technical specifications

TIF800Z — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIF800Z-TDS_EN_REV03.1.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIF800Zdatasheet property table
ParameterValue (typical / as stated)Method / note
ColorGrayVisual
ConstructionCeramic filled silicone elastomer
Thickness range0.012"(0.3mm)~0.20" (5.0mm)ASTM D374
Hardness (thickness>0.75mm)55 Shore00ASTM 2240
Hardness (thickness≤0.75mm)75 Shore00ASTM 2240
Specific Gravity (g/cm³)3.5 g/cm³ASTM D297
Operating Temp-40~160 °C
Dielectric Breakdown Voltage>4000 VACASTM D149
Dielectric Constant @1MHz5.5ASTM D150
Volume Resistivity (Ω·cm)>2.0×10¹²ASTM D257
Thermal Conductivity (W/m·K)11.0ASTM D5470
Thermal impedance (0.3mmT@10psi)0.090 °C·in²/WASTM D5470
Flame Rating94-V0UL E331100

* Match values to the PDF revision cited on your purchase order.

Same product family

Related silicone thermal pads models

Back to family overview
Modelλ (W/m·K)View
TIF100-10-02S1 W/m·KDetails
TIF100-12-66U1.2 W/m·KDetails
TIF100-15-11U1.5 W/m·KDetails
TIF100-18-02S1.8 W/m·KDetails
TIF500-18-11US1.8 W/m·KDetails
TIF100-20-05E2 W/m·KDetails
TIF200-20-14S2 W/m·KDetails
TIF4002 W/m·KDetails
FAQ

TIF800Z — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIF800Z?

The customer workbook lists nominal through-plane conductivity as 11 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIF800Z die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIF800Z?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIF800Z RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

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