TIE280-25AB Epoxy Potting Compound
- Breakdown Strength (V/mm)
- ≥10,000
- Density (g/cm³)
- 2.0
- Dielectric Constant @ 1 MHz
- 4.2
- Flame Rating
- V-0
- Hardness (Shore D)
- 85
- Part A Viscosity (mPa·s)
- 50,000
TIE280-25AB — Product overview
TIE® 280-25AB is a two-component epoxy resin sealant with good thermal conductivity and room temperature curing properties. It can complete the curing process at room temperature and is convenient for on-site operation and construction. And this material has excellent fire and flame retardant properties, which can meet the high safety requirements of electronic devices. It is particularly suitable for the sealing protection of capacitors, small electronic components, and precision circuit modules, and can provide long-term reliable mechanical support and environmental protection for sensitive components.
TIE280-25AB — Features
Good thermal conductivity
Excellent insulation performance
Two-part formulation for easy storage
Excellent low and high temperature mechanical and chemical stability
Ambient or accelerated cure schedules
Where this grade is used
Typical application targets for this grade include Electronic component encapsulation protection, Power Supply and Electrical Control, LED Lighting and Display, New Energy and Automotive Electronics, Communication and network equipment.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
TIE280-25AB — datasheet specifications
Values below are transcribed from the official datasheet (PDF: tie280-25ab.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Uncured Material Properties | ||
| Construction | Epoxy resin | — |
| Color / Part A | Black | Visual |
| Color / Part B | Gray | Visual |
| Part A Viscosity (mPa·s) | 50,000 | ASTM D2196 |
| Part B Viscosity (mPa·s) | 30,000 | ASTM D2196 |
| Mix Ratio | 1 : 1 | — |
| Shelf Life (Month) | 12 (Unopened) | — |
| Cure Schedule | ||
| Cure @ 25 °C (hours) | 6 | Ziitek Test Method |
| Cure @ 70 °C | 35 mins | Ziitek Test Method |
| Cure @ 100 °C | 15 mins | Ziitek Test Method |
| Cure Material Properties | ||
| Color | Gray | Visual |
| Density (g/cm³) | 2.0 | ASTM D792 |
| Hardness (Shore D) | 85 | ASTM D2240 |
| Breakdown Strength (V/mm) | ≥10,000 | ASTM D149 |
| Dielectric Constant @ 1 MHz | 4.2 | ASTM D150 |
| Volume Resistivity (Ω·cm) | > 1.0×10¹² | ASTM D257 |
| Thermal Conductivity (W/m·K) | 2.5 | ASTM D5470 |
| Recommended Operating Temperature (°C) | -40 ~ 160 | — |
| Flame Rating | V-0 | UL 94 |
* Match values to the PDF revision cited on your purchase order.
Related epoxy potting compounds models
TIE280-25AB — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIE280-25AB?
The customer workbook lists nominal through-plane conductivity as 2.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIE280-25AB die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Epoxy potting compounds parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIE280-25AB?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIE280-25AB RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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