
TS-TIR700-25 Thermal Graphite Sheet
- Density (g/cm³)
- 2.9
- Flame Rating
- V-0
- Hardness (Shore OO)
- 85±5 / 60±10
- Thermal Conductivity (W/m·K)
- 25
- Thickness range
- 0.3~5.0 mm
- Color
- Gray
TS-TIR700-25 — Product overview
TS-TIR®700-25 series is a high-performance carbon fiber thermal pad that combines thermally conductive carbon fibers with a polymer-based silicone matrix. Utilizing advanced processing techniques to precisely align thermal pathways, it delivers exceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight, and mechanically flexible properties, it is ideal for use in 5G devices, high-performance chips, and other high heat flux applications.
TS-TIR700-25 — Features
Good thermal conductivity 25 W/mK
Ultra-low thermal resistance
Works under low pressure
Non-insulating material
Non-adhesive surface
Where this grade is used
Typical application targets for this grade include Between chips and heat dissipation modules, 5G communication equipment, Optoelectronics industry, Wearable devices.

Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.

Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TS-TIR700-25 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TS-TIR700-25--0525EN.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Gray | Visual |
| Construction | Carbon Fiber Filled Silicone | — |
| Thickness range | 0.01"~0.02" (0.3~0.5mm) / 0.04"~0.20" (1.0~5.0mm) | ASTM D374 |
| Hardness (Shore OO) | 85±5 / 60±10 | ASTM D2240 |
| Density (g/cm³) | 2.9 | ASTM D792 |
| Recommended Operating Temp (°C) | -40~200 | — |
| Thermal Conductivity (W/m·K) | 25 | ASTM D5470 |
| Specific Heat Capacity (J/g·°C) | 0.75 | ASTM E1269 @25°C |
| Flame Rating | V-0 | UL94 Equivalent |
| RoHS | Compliant | — |
* Match values to the PDF revision cited on your purchase order.
Related graphite sheets for thermal management models
| Model | Thickness | X-Y Conductivity | View |
|---|---|---|---|
| TIR300 | 0.012~0.040 mm | 1200~1700 W/m·K | Details |
| TIR300AL | 0.050~0.080 mm | 450 W/m·K | Details |
| TIR300C | 0.040~0.080 mm | 700 W/m·K | Details |
| TIR300CU | 0.060~0.080 mm | 320 W/m·K | Details |
| TIR300G | 0.005~0.15 mm | 2.0 | Details |
| TIR300L-A1 | 0.15 mm | 2.5 | Details |
| TIR600 | 0.127~0.508 mm | 240 W/m·K | Details |
| TS-TIR700-09 | 1.0~5.0 mm | 9.0 | Details |
TS-TIR700-25 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TS-TIR700-25?
The customer workbook lists nominal through-plane conductivity as — W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TS-TIR700-25 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Graphite sheets for thermal management parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TS-TIR700-25?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TS-TIR700-25 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

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