TIG780-25 Thermal Grease
- Density (g/cm³)
- 2.5
- Minimum Bond Line Thickne…
- 0.014 mm
- Recommended Operating Tem…
- -45 ~ 200
- Thermal Conductivity (W/m·K)
- 2.5
- Viscosity (mPa·s @ 25°C)
- 148000
- Color
- Gray
TIG780-25 — Product overview
TIG™780-25 is an environmentally safe silicone-based thermal grease engineered to resolve overheating and reliability issues in electronic assemblies. It is supplied as a paste that fills the bond line between electronic components and heat sinks, fully wetting contact surfaces to form an interface with very low thermal impedance and offering heat-dissipation efficiency superior to many competing greases.
TIG780-25 — Features
Outstanding low thermal resistance of 0.02 °C·in²/W
Non-toxic and environmentally safe
Excellent electrical insulation properties
Thoroughly wets out contact surfaces to create low thermal resistance
Stable performance across a wide operating temperature range
Where this grade is used
Typical application targets for this grade include Microprocessors, Chipsets, Graphic processing chips, IGBT modules, MOSFETs and standard packages such as TO220 and TO240.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIG780-25 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIG780-25-TDS_CN_REV02.1.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Gray | Visual |
| Composition | Metal oxide / silicone oil | Internal |
| Density (g/cm³) | 2.5 | ASTM 2240 |
| Viscosity (mPa·s @ 25°C) | 148000 | Brookfield DV2T |
| Thermal Conductivity (W/m·K) | 2.5 | ASTM D5470 |
| Minimum Bond Line Thickness (mm) | 0.014 | ASTM D374 |
| Thermal Impedance (°C·in²/W) @50 psi | 0.02 | ASTM D5470 |
| Recommended Operating Temperature (°C) | -45 ~ 200 | Internal |
| Evaporation (TML) (200°C @ 24 hrs) | 0.48% | ASTM E595 |
* Match values to the PDF revision cited on your purchase order.
Related thermal grease models
TIG780-25 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIG780-25?
The customer workbook lists nominal through-plane conductivity as 2.5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIG780-25 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal grease parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIG780-25?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIG780-25 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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