TIG780-50HP Thermal Grease
- Bond Line Thickness (mm)
- 0.008 mm
- Density (g/cm³)
- 2.30
- Recommended Operating Tem…
- -40 ~ 200
- Thermal Conductivity (W/m·K)
- 5.0
- Viscosity (mPa·s)
- 200000
- Color
- Gray
TIG780-50HP — Product overview
TIG®780-50HP is an environmentally friendly silicone-based thermal paste engineered to efficiently solve overheating in electronic devices and improve long-term reliability. The paste fully wets the surfaces of electronic components and heat sinks, fills the gaps between them, eliminates trapped air, and significantly improves heat-dissipation efficiency, forming an extremely low thermal-resistance interface for excellent thermal-conductivity performance. The high-performance HP variant is targeted at demanding applications that benefit from a very thin bond line (down to 0.008 mm) and consistently low thermal impedance under typical clamp pressures.
TIG780-50HP — Features
High thermal conductivity of 5.0 W/m·K
Excellent low thermal resistance with thermal impedance as low as 0.012 °C·in²/W @50 psi
Very thin bond line (0.008 mm) for tight thermal interfaces
Good electrical insulation
Excellent long-term stability
Non-toxic, environmentally friendly and RoHS-compliant
Where this grade is used
Typical application targets for this grade include AI servers, Industrial equipment, Medical electronic devices, LED TVs and LED lighting fixtures, Automotive electronics for new energy and intelligent vehicles, High-end consumer electronics and portable devices.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
Drives · IGBT · controllers · sensors
Power Tools & Control Systems
Industrial controls, motor drives, power-stage IGBTs, and rugged modules — thermal interfaces, sealing, and encapsulation built for serviceable assemblies and harsh environments.
TIG780-50HP — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIG780-50HP_Data-sheet-.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Gray | Visual |
| Construction | Metal oxide / silicone oil | Ziitek Test Method |
| Density (g/cm³) | 2.30 | ASTM D792 |
| Thermal Conductivity (W/m·K) | 5.0 | ASTM D5470 |
| Bond Line Thickness (mm) | 0.008 | ASTM D374 |
| Thermal Impedance (°C·in²/W) @30 psi | 0.015 | ASTM D5470 |
| Thermal Impedance (°C·in²/W) @50 psi | 0.012 | ASTM D5470 |
| Recommended Operating Temperature (°C) | -40 ~ 200 | — |
| Viscosity (mPa·s) | 200000 | GB/T 10247 |
* Match values to the PDF revision cited on your purchase order.
Related thermal grease models
TIG780-50HP — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIG780-50HP?
The customer workbook lists nominal through-plane conductivity as 5 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIG780-50HP die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermal grease parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIG780-50HP?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIG780-50HP RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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