TIF100-10-02S — Silicone thermal pads (1 W/m·K nominal) — gallery view 1 of 4

TIF100-10-02S Silicone Thermal Pad

Dielectric Breakdown Volt…
>5500 VAC
Dielectric Constant @1MHz
4.5
Flame Rating
94-V0
Hardness (Shore 00)
45
Specific Gravity (g/cm³)
2.3
Thermal Conductivity (W/m·K)
1.0
Download TIF100-10-02S datasheet (PDF)
Overview

TIF100-10-02S — Product overview

TIF™100-10-02S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of the heat-generating electronic components.

Features

TIF100-10-02S — Features

  • Good thermal conductivity

  • Naturally tacky needing no further adhesive coating

  • Soft and Compressible for low stress applications

  • Available in varies thickness

Technical specifications

TIF100-10-02S — datasheet specifications

Values below are transcribed from the official datasheet (PDF: TIF100-10-02S-TDS_EN_REV02.pdf). Use the linked PDF for sign-off and lot-specific CoA.

Request application engineering support
TIF100-10-02Sdatasheet property table
ParameterValue (typical / as stated)Method / note
ColorLight GrayVisual
ConstructionCeramic filled silicone elastomer
Thickness range0.020"(0.5mm)~0.200" (5.0mm)ASTM D374
Hardness (Shore 00)45ASTM 2240
Specific Gravity (g/cm³)2.3ASTM D297
Operating Temp-40~160 °C
Dielectric Breakdown Voltage (T= 1.0mm)>5500 VACASTM D149
Dielectric Constant @1MHz4.5ASTM D150
Volume Resistivity (Ω·m)1.0×10¹²ASTM D257
Thermal Conductivity (W/m·K)1.0ASTM D5470
Thermal Conductivity (W/m·K)1.0GB-T32064
Outgassing (TML)0.35%ASTM E595
Flame Rating94-V0UL E331100

* Match values to the PDF revision cited on your purchase order.

Same product family

Related silicone thermal pads models

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Modelλ (W/m·K)View
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TIF100-18-02S1.8 W/m·KDetails
TIF500-18-11US1.8 W/m·KDetails
TIF100-20-05E2 W/m·KDetails
TIF200-20-14S2 W/m·KDetails
TIF4002 W/m·KDetails
TIF500-20-01U2 W/m·KDetails
FAQ

TIF100-10-02S — common questions

Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.

Talk to an engineer
What is the nominal thermal conductivity of TIF100-10-02S?

The customer workbook lists nominal through-plane conductivity as 1 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.

Can Ziitek supply TIF100-10-02S die-cut or in custom thickness?

Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.

Where is the documentation for TIF100-10-02S?

Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.

Is TIF100-10-02S RoHS-aligned?

Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.

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