TIF400 Silicone Thermal Pad
- Dielectric Breakdown Volt…
- >5500 VAC
- Dielectric Constant @1MHz
- 4.7
- Flame Rating
- 94 -V0
- Hardness
- 45
- Specific Gravity (g/cm³)
- 2.65
- Thermal Conductivity (W/m·K)
- 2.0
TIF400 — Product overview
TIF™400 Series thermally conductive interface materials are applied to fill the air gaps between heat-generating components and the heat dissipation fins or metal base. Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat transfers to the metal housing or dissipation plate from the heat-generating components or the entire PCB, effectively enhancing the efficiency and service life of heat-generating electronic components.
TIF400 — Features
Good thermal conductivity
Naturally tacky needing no further adhesive coating
Soft and Compressible for low stress applications
Available in varies thickness
Where this grade is used
Typical application targets for this grade include Cooling components to the chassis of frame, Set Top Box, Car Battery & Power Supply, Charging Pile, LED TV/ Lighting, Graphics Card Thermal Module.
Servers · GPU · accelerators · DIMM
Data Center & AI Servers
High-flux silicon and dense PCBs — CPU/GPU bond-lines, VRM/DIMM/NIC interfaces, and accelerator cold-plate paths. Match grade against clamp force, TIM impedance, and rework cadence.
EV packs · OBC · inverters · BMS
New energy
EV battery modules, traction inverters, on-board chargers, and renewable power conversion — thermal management for high-current cycling loads with HV isolation requirements.
TIF400 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: TIF400-Series-Datasheet.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Yellow | Visual |
| Construction | Ceramic filled silicone elastomer | — |
| Thickness range | 0.01"(0.25mm)~0.20" (5.0mm) | ASTM D374 |
| Hardness | 45 | ASTM 2240 |
| Specific Gravity (g/cm³) | 2.65 | ASTM D297 |
| Operating Temp | -40 ~160 °C | — |
| Dielectric Breakdown Voltage (T = 1.0mm) | >5500 VAC | ASTM D149 |
| Dielectric Constant @1MHz | 4.7 | ASTM D150 |
| Volume Resistivity (Ω·cm) | >5.3×10¹² | ASTM D257 |
| Thermal Conductivity (W/m·K) | 2.0 | ASTM D5470 / ISO22007-2.2 |
| Flame Rating | 94 -V0 | UL E331100 |
* Match values to the PDF revision cited on your purchase order.
Related silicone thermal pads models
| Model | Series | λ (W/m·K) | Hardness | View |
|---|---|---|---|---|
| TIF100-10-02S | TIF100 | 1 W/m·K | 45 | Details |
| TIF100-12-66U | TIF100 | 1.2 W/m·K | 27~65 | Details |
| TIF100-15-11U | TIF100 | 1.5 W/m·K | 27~65 | Details |
| TIF100-18-02S | TIF100 | 1.8 W/m·K | 45~65 | Details |
| TIF500-18-11US | TIF500 | 1.8 W/m·K | 20~65 | Details |
| TIF100-20-05E | TIF100 | 2 W/m·K | 35~65 | Details |
| TIF200-20-14S | TIF200 | 2 W/m·K | 45±5 | Details |
| TIF500-20-01U | TIF500 | 2 W/m·K | 27±5 | Details |
TIF400 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIF400?
The customer workbook lists nominal through-plane conductivity as 2 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIF400 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Silicone thermal pads parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIF400?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIF400 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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