TIS580-13 Thermal Silicone Adhesive
- Dielectric Constant
- 2.9
- Dielectric Strength (KV/mm)
- 10
- Flame retardant
- UL 94 V-0
- Hardness
- 25 Shore A
- Operating temperature
- -60°C ~250°C
- Thermal Conductivity (W/m·K)
- 1.3
TIS580-13 — Product overview
TIS™580-13 Series is dealcoholized, one component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-13 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-13 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
TIS580-13 — Features
Available in varies thickness
Good thermal conductivity
Good maneuverability and good adhesion
Low shrinkage
Low viscosity, leads to void-free surface
Good solvent resistance, water resistance
Where this grade is used
Typical uses for this thermally conductive silicone adhesive line include the following industries and applications.
TIS580-13 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: tis580-13.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Color | Black paste | Visual |
| Viscosity Brookfield (Uncured) | 20K cPs | ASTM D1084 |
| Cure type (one component) | Dealcoholized | — |
| Tack-free Time | ≤ 20 min | — |
| Cure Time | 3~7 Days | — |
| Gravity (g/cm³) | 1.4 | ASTM D297 |
| Hardness | 25 Shore A | ASTM D2240 |
| Elongation | ≥ 150 psi | ASTM D412 |
| Lap Shear Strength | ≥ 2.0 MPa | ASTM D1876 |
| Peel Strength | ＞3.5 N/mm | ASTM D1876 |
| Operating temperature | -60°C ~250°C | — |
| Dielectric Constant | 2.9 | ASTM D150 |
| Dielectric Strength (KV/mm) | 10 | ASTM D149 |
| Volume Resistivity (Ω·m) | 2.0×10¹⁶ | ASTM D257 |
| Thermal Conductivity (W/m·K) | 1.3 | ASTM D5470 |
| Flame retardant | UL 94 V-0 | E331100 |
* Match values to the PDF revision cited on your purchase order.
Related thermally conductive silicone adhesives models
TIS580-13 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIS580-13?
The customer workbook lists nominal through-plane conductivity as 1.3 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIS580-13 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermally conductive silicone adhesives parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIS580-13?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIS580-13 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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