TIS580-20 Thermal Silicone Adhesive
- Density (g/cm³)
- 1.6
- Dielectric Constant
- 2.9
- Dielectric Strength (KV/mm)
- 21
- Flame Retardancy
- UL94 V-0
- Hardness (Shore A)
- 45
- Thermal Conductivity
- 2.0 W/(m·K)
TIS580-20 — Product overview
TIS™580-20 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-20 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-20 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
TIS580-20 — Features
Good thermal conductivity
Good maneuverability and good adhesion
Low shrinkage
Low viscosity, leads to void-free surface
Good solvent resistance, water resistance
Longer working life
Where this grade is used
Typical uses for this thermally conductive silicone adhesive line include the following industries and applications.
TIS580-20 — datasheet specifications
Values below are transcribed from the official datasheet (PDF: tis580-20.pdf). Use the linked PDF for sign-off and lot-specific CoA.
Request application engineering support| Parameter | Value (typical / as stated) | Method / note |
|---|---|---|
| Appearance | White paste | — |
| Density (g/cm³) | 1.6 | ASTM D297 |
| Tack-free time | ≤20 min | — |
| Cure type (1-component) | Dealcoholized | — |
| Viscosity Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time | 3-7 d | — |
| Elongation | ≥200 % | ASTM D412 |
| Hardness (Shore A) | 45 | ASTM D2240 |
| Lap Shear Strength | ≥2.5 MPa | ASTM D1876 |
| Peel Strength | ＞5 N/mm | ASTM D1876 |
| Operation temperature | -60～250 °C | — |
| Volume Resistivity (Ω·cm) | 2.0×10¹⁶ | ASTM D257 |
| Dielectric Strength (KV/mm) | 21 | ASTM D149 |
| Dielectric Constant | 2.9 | ASTM D150 |
| Thermal Conductivity | 2.0 W/(m·K) | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
* Match values to the PDF revision cited on your purchase order.
Related thermally conductive silicone adhesives models
TIS580-20 — common questions
Replacing another vendor’s TIM or need a stack review? Send drawings — applications responds quickly.
Talk to an engineerWhat is the nominal thermal conductivity of TIS580-20?
The customer workbook lists nominal through-plane conductivity as 2 W/m·K. What you measure depends on pressure, gap, and fixture — use the technical documentation as the reference.
Can Ziitek supply TIS580-20 die-cut or in custom thickness?
Yes — send DXF/DWG outlines and stack height. Thermally conductive silicone adhesives parts are routinely converted at Ziitek; tolerances depend on thickness and geometry.
Where is the documentation for TIS580-20?
Download the technical documentation from this page when available. If your revision differs, name the file from your RFQ so applications engineering matches it.
Is TIS580-20 RoHS-aligned?
Ziitek targets RoHS-oriented formulations across TIM lines. Cite the compliance block for audits and tell us if you need additional regional substance lists.
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